Ultrafast laser multi-focus large-spacing parallel processing device and method

An ultra-fast laser and processing device technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of limited laser processing format and low processing efficiency, and achieve the effect of improving processing efficiency and ensuring processing quality

Pending Publication Date: 2021-05-28
ZHEJIANG NORMAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the distance between the beams of the prior art is on the order of microns, which limits the width of laser processing, and the processing efficiency is still low

Method used

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  • Ultrafast laser multi-focus large-spacing parallel processing device and method
  • Ultrafast laser multi-focus large-spacing parallel processing device and method
  • Ultrafast laser multi-focus large-spacing parallel processing device and method

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Embodiment Construction

[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments, but this should not be used as a limitation to the protection scope of the present application.

[0030] Such as figure 1 As shown, an ultrafast laser multi-focus large-pitch parallel processing device is characterized in that it includes an ultrafast laser generator 1, a beam expander 2, a beam splitter prism 3, a spatial light modulator 4, a laser mirror 5, a long Distance beam splitting transmission array group 6, focusing galvanometer group 7, workpiece 8;

[0031] The device installation and assembly process is as follows:

[0032] The ultrafast laser generator 1 is connected with a power supply and a control system for generating ultrashort pulse laser beams;

[0033] The beam expander 2 is installed on the beam path generated by the ultrafast laser generator 1, and is used to expand the ultrafast laser beam;

[0034] The beam splitter prism 3 ...

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Abstract

The invention discloses an ultrafast laser multi-focus large-spacing parallel processing device and method. The device comprises an ultrafast laser generator, a beam expander, a beam splitter prism, a spatial light modulator, a reflector, a long-distance beam splitting transmission array group, a focusing galvanometer group and workpieces. The ultrafast laser generator generates ultrashort pulse laser beams, the ultrashort pulse laser beams are modulated by the spatial light modulator and an optical device, the laser beams are subjected to light splitting transmission by the long-distance light splitting transmission array group and are incident to the focusing galvanometer group to be focused, and multi-focus parallel machining is performed on a plurality of areas on a large-format workpiece and the multiple workpieces. According to the ultrafast laser multi-focus large-spacing parallel processing device and method, the micron-scale light beam spacing limitation modulated by the spatial light modulator and the optical device is broken through, the beam splitting distance is increased from the micron scale to the meter scale or above, the problem that a plurality of areas on a large-format workpiece or a plurality of workpieces are difficult to process is solved, and compared with the micro-spacing light beam array processing modulated by the spatial light modulator and the optical device, the method is larger in processing breadth and higher in processing efficiency.

Description

technical field [0001] The invention relates to the technical field of special processing, in particular to an ultrafast laser multi-focus large-pitch parallel processing device and method. Background technique [0002] With the continuous development of short-pulse and ultra-short-pulse lasers, the continuous upgrading of large-format laser processing technology and the transformation of market demand, in order to obtain higher processing efficiency, more and more applications have been made in the fields of consumer electronics, new displays, and biomedicine. The more applications, these new requirements become more stringent for laser processing fineness and high efficiency. Stimulated by strong market demand, ultrafast laser technology has continuously made new breakthroughs, and has quickly become the development direction that the industry focuses on. [0003] Ultrafast lasers have ultra-short pulses and ultra-intense characteristics, and can obtain extremely high pea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/06B23K26/067
CPCB23K26/064B23K26/0643B23K26/0648B23K26/0652B23K26/0673
Inventor 孙爱西郑佳佳王成武孟凡许
Owner ZHEJIANG NORMAL UNIVERSITY
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