Wafer photoetching machine

Abstract

The invention discloses a wafer photoetching machine which structurally comprises a machine body, an adjusting device, a display screen, a ventilator, an indicator lamp, a working cavity and a heat dissipation port. When the wafer photoetching machine is used, a wafer chip is clamped between two clamping concave discs through cooperation of a smooth sheet and a claw inclined block, so that it is guaranteed that the wafer chip can be stably positioned between the two clamping concave discs; a gap is formed between the wafer chip and a carrying table, so that a worker can conveniently take the machined wafer chip; the rotating wheel drives the clamping head to turn over the wafer chip clockwise, and the wafer chip can directly make contact with the friction plate through the contact arc piece after being turned over to generate large friction resistance, so that the stability of the wafer chip after being turned over is guaranteed, the photoetching element in the working cavity can accurately perform photoetching processing on the other side of the wafer chip, and the photoetching efficiency of the wafer chip is improved.

Description

technical field [0001] The invention relates to the field of single crystal silicon processing, in particular to a wafer photolithography machine. Background technique [0002] With the development of science and technology, the development of photolithography technology is extremely rapid. Photolithography technology is very important for the development of microelectronics industry. Photolithography technology uses the principle similar to photolithography to etch fine patterns on the mask layer on the surface of semiconductor wafers. Advanced surface processing technology, and then useless parts are removed through etching process, and the wafer chip is rotated and adjusted by flipping the element, which is convenient for double-sided photolithography. When performing photolithography processing, the areas that need to be improved are as follows: [0003] When performing photolithography processing on the wafer, under the action of light, the pattern on the mask plate is ...

AI Technical Summary

Problems solved by technology

[0003] When performing photolithography processing on the wafer, under the action of light, the pattern on the mask plate is transferred to the substrate with the help of photoresist. During the processing, the wafer chip is directly placed on the stage On the surface, because the appearance of the wafer chip is disc-shaped and similar to the structure of an optical disc, the wafer chip will be flat on the carrier, which is not convenient for the staff to take, and it is necessary to work on both sides of the wafer chip during processing. Personnel turn it over, making the lithography position of the wafer chip inaccurate and reducing the lithography efficiency of the wafer chip

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