Preparation method of high-hardness and low-warpage double-layer small-particle solid fluorescent adhesive film

Abstract

The invention relates to a fluorescent adhesive film in the field of semiconductors, in particular to a preparation method of a high-hardness and low-warpage double-layer small-particle solid fluorescent adhesive film. An inner layer is a fluorescent adhesive film which contains fluorescent powder and has the thickness of 30-70 microns, and an outer layer is a transparent adhesive film which contains 50-80 wt% of inorganic filler and has the thickness of 30-80 microns. The preparation method comprises the following steps of: 1, blade-coating a release film with a fluorescent adhesive film; 2, blade-coating the release film with a transparent adhesive film; 3, compounding and overlapping the fluorescent adhesive film and the transparent adhesive film by using a vacuum laminating machine; and 4, cutting the obtained material after high-temperature curing. The solid fluorescent adhesive film has the following advantages: the organosilicon transparent adhesive film added with the micron-sized inorganic filler has high hardness (ShoreD80-ShoreD90), is scratch-proof, beneficial to absorption by a client, free from deformation and warping and excellent in heat conduction and light attenuation resistance, and can be used for high-power (4.5 W) LED devices.

Description

technical field [0001] The present application relates to a fluorescent adhesive film in the field of semiconductors, in particular to a method for preparing a double-layer small-particle solid-state fluorescent adhesive film with high hardness and low warpage. [0002] technical background [0003] LED (Semiconductor Light Emitting Diode) is widely used in lighting, backlighting and other fields due to its advantages of low energy consumption, long life, small size and the like. The packaging process is a very important process in the LED manufacturing process, which has a very significant impact on the performance and cost of the LED. [0004] The existing LED packaging technologies mainly include device-level packaging technology, wafer-level LED packaging (WLP) technology, chip-scale packaging (CSP) technology, etc. These technologies have their own advantages, but at the same time, they all have some defects. In view of this, researchers are also committed to improving ...

AI Technical Summary

Problems solved by technology

Although this type of packaging has improved compared with traditional technologies in terms of operation convenience and cost, it still has defects. For example, it is not conducive to the heat transfer generated when the LED is working, and this problem also has a great impact on the performance of the LED.

[0006] However, the hardness of silica gel is relatively low, and the surface of the package is easy to scratch, easily deformed and warped, resulting in poor operation performance of the thimble, so it is necessary to increase the hardness of the package.

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