Recyclable carrier and method for manufacturing embedded circuit by using same

Abstract

The invention discloses a method for manufacturing an embedded circuit by using a recyclable carrier, which comprises the steps of preparing the carrier, generating a conductive layer on the carrier, and then performing pattern electroplating to manufacture the circuit; overlapping the obtained carrier with the circuit, a prepreg and a core plate together, and then feeding into a pressing machine for pressing; removing the carrier after pressing; drilling holes; performing copper melting; then carrying out dry film pressing, pattern electroplating and dry film removal; removing the conductive layer on the bottom plate; and carrying out ink printing, surface treatment and other subsequent processes are carried out to finally obtain the finished circuit board with the embedded circuit. According to the method provided by the invention, pattern electroplating is directly carried out on the carrier, additional copper foil is not needed, the use amount of copper is greatly reduced, the carrier can be recycled, the cost is saved, and the method is green and environment-friendly. According to the method, positioning holes do not need to be machined for positioning, and compatibility with a standard printed circuit board manufacturing process is good; no gap exists between the carrier and the conductive layer, the risk of liquid medicine residue in subsequent etching is avoided, and the product quality is effectively improved.

Description

technical field [0001] The invention relates to a recyclable carrier and a method for making embedded circuits using the carrier, belonging to the technical field of printed circuit boards. Background technique [0002] With the rapid development of electronic products in the direction of high integration, higher requirements are put forward for the stability of high-current operation, high-voltage resistance and high thermal conductivity of printed circuit boards. In order to make the circuit board meet the requirements of fine lines and high current, the method of embedding copper blocks or copper wires is usually used. However, the embedding method usually requires the use of a carrier, and the choice of the carrier has a great impact on the manufacturing process and product reliability. However, the existing combination between the carrier and the copper foil is mostly an indirect combination, and there are many problems, such as the carrier cannot be reused, and positi...

AI Technical Summary

Problems solved by technology

However, the embedding method usually requires the use of a carrier, and the choice of the carrier has a great impact on the process and product reliability.

However, the existing combination between the carrier and the copper foil is mostly an indirect combination, and there are many problems, such as the carrier cannot be reused, and positioning holes need to be processed for positioning, which is poorly compatible with the standard PCB process; the copper foil carrier and There is a gap between the copper foils, and liquid medicine will enter the gap during subsequent etching. These residual liquid medicines will continue to attack the circuit and affect product quality

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