Electroplating device for copper plating

Abstract

The invention relates to an electroplating device for copper plating. The electroplating device for copper plating comprises a hanging bracket and blade plates; an electrode rod electrically connected with a power supply is arranged on the hanging bracket; a sliding frame is arranged on the inner side of the hanging bracket; two sliding blocks are arranged on the sliding frame through a slideway; a tension spring is connected between the two sliding blocks; a servo motor for driving a plating wheel to rotate is arranged at the rear part of the plating wheel; a first hanging chain is arranged on the two sliding blocks; when the plating wheel rotates forwards and backwards, the two sliding blocks are driven by the first hanging chain to move oppositely or reversely; a rotatable hanging hook is arranged on the bottom face of each sliding block; and a sliding pipe is arranged at the bottom end of the hanging bracket. The hanging hooks used for hanging product pieces are arranged in the hanging bracket through the sliding frame, oxide scale falling off from the surfaces of the workpieces in the electroplating process of the hung product pieces falls on the blade plates, the blade plates enable the surging effect generated by a solution to beat the product pieces, then the oxide scale on the product pieces is forced to be flushed downwards and collected, impurities are prevented from sinking in an electroplating pool, and therefore the situation that the impurities are plated on the surfaces of the workpieces again in the electroplating process of the product pieces, and consequently the product quality is affected is avoided.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device for copper plating. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and improve appearance. Copper materials are widely used in circuit environments because of their high conductivity. Conductivity, the surface needs to be electroplated by electroplating process. [0003] During the electroplating process, use the hanger mechanism to hang the copper plate, copper wire or the product made of copper in the electroplating pool, inject the coating solution for electro...

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Problems solved by technology

[0004] However, when the raw material is lifted from the pickling pool and directly hoisted into the electroplating pool for electroplating, the surface of the workpiece will leave an oxide layer that is about to fall off due to the previous pickling process, and these oxide layers will sink into the electroplating pool again with the workpiece, resulting in The purity of the electroplating solution is reduced, and these oxide layer impurities will be repeatedly plated on the surface of the workpiece during electroplating, thereby affecting product quality. Therefore, it is urgent to design a more reasonable electroplating device to solve this problem

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