Method for opening terminal area of high-efficiency silicon-based micro display device

Abstract

The invention discloses a method for opening a terminal area of a high-efficiency silicon-based micro-display device. The method comprises the following steps: 1, pasting a PET adhesive tape: pasting the PET adhesive tape on a PAD area after a previous process is completed; 2, packaging operation: carrying out OLED and thin film packaging operation on a piece attached with the PET adhesive tape; 3, PET adhesive tape removal: conducting PET adhesive tape removal on the piece having been subjected to OLED and thin film packaging so as to enable a PAD area to be exposed; and 4, cleaning: cleaning the silicon wafer obtained in the step 3, and completing a terminal area opening process. According to the method, poor patterns caused by coating, exposure and development can be avoided, etching residues and poor over-etching caused by dry etching are avoided, incomplete and poor wet photoresist removal is avoided, and the requirement for the liquid chemical tolerance of a TFE film layer is lowered; and on the other hand, a technological process is shortened, cost is greatly saved, and productivity is improved.

Description

technical field [0001] The invention relates to the technical field of silicon-based microdisplays, in particular to a method for opening terminal regions of high-efficiency silicon-based microdisplay devices. Background technique [0002] At present, AR and VR technologies are developing rapidly, and wearable AR and VR devices are attracting more and more people's attention, and their market demand is correspondingly expanding rapidly; R&D and progress. Under this background, the development of silicon-based Micro OLED microdisplay devices is also favored by more and more people; at the same time, its process technology is also slowly maturing and improving. In the silicon-based Micro OLED micro-display device manufacturing process, the Die Bond and Wire Bond processes are involved in the module section process, and the Die is bonded to the PCB or FPC, and the Die is bonded to the PCB or FPC by wire bonding. FPC connection. The wiring area on the die is called the PAD ar...

AI Technical Summary

Problems solved by technology

[0003] At present, the process of opening the terminal area of ​​silicon-based micro OLED microdisplays is relatively complicated. The process is to first coat, expose, and develop to define the PAD position pattern, then perform dry etching to transfer the pattern to Die, and finally perform wet removal Photoresist: In the above process, poor glue exposure and development can easily cause PR abnormalities, affect graphic definition, poor dry etching, easy to produce residues and poor over-engraving, etc., resulting in poor wiring contact and abnormal conductivity, etc., wet deglue process, the glue removal is not clean, resulting in poor bonding, which affects the performance of the device; and the existing process has high requirements for the tolerance of TFE liquid medicine, and the process is difficult; and each process has a lot of yield loss, and the process Complicated, the process takes a long time, which affects the production capacity

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