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3D printing X-band CT structure spherical cavity waveguide bandpass filter and its manufacturing method

A band-pass filter and 3D printing technology, applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problem of increasing manufacturing costs and post-commissioning time, and it is difficult to meet the design principles of miniaturization, low insertion loss, and high selection. High performance and no-load quality factor design difficulties and other issues

Active Publication Date: 2022-03-04
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This not only makes it difficult to meet the miniaturization design principles of modern microwave devices, but also increases the preparation cost and post-commissioning time, and also brings design difficulties to achieve low insertion loss, high selectivity, and high no-load quality factor.

Method used

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  • 3D printing X-band CT structure spherical cavity waveguide bandpass filter and its manufacturing method
  • 3D printing X-band CT structure spherical cavity waveguide bandpass filter and its manufacturing method
  • 3D printing X-band CT structure spherical cavity waveguide bandpass filter and its manufacturing method

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Embodiment 1

[0040] Embodiment 1, the center frequency of the filter involved in the present invention is 9GHz, the relative bandwidth is 5%, the return loss is better than 30dB, and the transmission zero point is located at 9.6GHz. According to the above indicators, the coupling coefficient of the filter (M 12 = M 23 =0.0637, M 13 =0.0425) and external quality factor (Q e =10.69) and specific physical dimensions.

[0041] According to the calculated coupling coefficient and external quality factor, the coupling coefficient M between the adjacent resonators of the spherical resonator filter is ij (i,j=1,2,3) and external quality factor Q e Perform parameter extraction. Figure 7 Shown is the extracted coupling coefficient M ij and the relationship between the radius r of the spherical cavity and the coupling diameter l. Figure 8 Shown is the relationship between the extracted external quality factor Qe and the radius r of the spherical cavity with the proportionality factor s. The ...

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Abstract

The invention discloses a 3D printing X-band CT structure spherical cavity waveguide bandpass filter and a manufacturing method thereof. It is composed of three spherical resonant cavities and input and output feed waveguides. The three resonant cavities are magnetically coupled. Two paths will be formed from the signal inlet S to the signal outlet L. No. 1 resonant cavity and No. 3 resonant cavity The existence of cross-coupling between them can generate a transmission zero point in the high-resistance band. Through CST software simulation, finally according to the overall structure of the CT structure spherical cavity filter, the actual device is prepared by 3D printing technology.

Description

technical field [0001] The invention relates to the fields of filter design and 3D printing, in particular to a design scheme of a spherical cavity waveguide bandpass filter with a CT topology. Background technique [0002] As an important device for separating signals in the system, in order to meet the design requirements of modern devices, the filter has high selectivity, low insertion loss, out-of-band rejection, and good quality factor as much as possible while realizing the miniaturization of the physical size. Excellent performance characteristics are particularly important. [0003] At present, in order to achieve higher selectivity in performance, traditional non-cross-coupled filters (such as maximum flattening filters, Chebyshev filters, etc.) can only sacrifice physical size and rely on increasing the individual filter cavity. Number (that is, increasing the order of the filter) to achieve. This not only makes it difficult to meet the miniaturization design pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/208H01P11/00
CPCH01P1/208H01P11/007
Inventor 李若琛徐军林怡呈张帆张翊
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA