Manifold type micro-channel heat sink with boss-like structure
A boss structure and micro-channel technology, which is applied to laser components, laser cooling devices, laser components, etc., can solve problems such as increased heat sink costs, uneven temperature, and large flow resistance of micro-channel structures, so as to increase the temperature Uniformity, uniform temperature, solve the effect of large flow resistance
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[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments.
[0023] Such as figure 1 As shown, the manifold-type microchannel heat sink with a boss-like structure described in this embodiment consists of a liquid inlet layer 1, a liquid separation layer 2, and a microchannel layer 3 arranged sequentially from top to bottom, and the cooling liquid passes through the liquid inlet layer. After layer 1 enters the liquid separation layer 2, the cooling liquid is sent into the microchannel layer through the manifold splitting structure, such as figure 2 As shown, the cooling liquid enters each microchannel from t...
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