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A kind of sn-bi-in-zn-ga low melting point high entropy alloy lead-free solder and its preparation method and application

A high-entropy alloy and lead-free solder technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of Bi segregation, brittleness of solder joints and low soldering temperature

Active Publication Date: 2022-03-29
HUNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art, only Sn-Bi solder has been used. The melting point of Sn-Bi solder is 139°C, which has the advantages of good wettability and low soldering temperature, but the Bi segregation of the solder during the soldering process And the problem of solder joint brittleness has not been solved
However, there is no solder formulated with the concept of high-entropy alloys among the currently used solders.

Method used

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  • A kind of sn-bi-in-zn-ga low melting point high entropy alloy lead-free solder and its preparation method and application
  • A kind of sn-bi-in-zn-ga low melting point high entropy alloy lead-free solder and its preparation method and application

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Embodiment 1

[0029] The Sn-Bi-In-Zn-Ga low-melting point high-entropy alloy lead-free solder of this example has the following components and atomic mole percentages: 20.0% for Sn, 20.0% for Bi, 20.0% for In, and 20.0% for Zn , Ga is 20.0%, and the preparation steps are as follows: prepare 100 g of raw materials Sn, Bi, In, Zn, and Ga with a purity greater than 99.99% according to equal atomic mole percentages. Put the prepared raw materials into the corundum crucible in order of melting point from high to low, and the element with the lowest melting point is on the top layer. Put the corundum crucible filled with the alloy material into the spiral induction coil in the high vacuum induction melting casting furnace, vacuumize with a mechanical pump for 20 minutes, turn off the vacuum pump and fill it with high-purity argon gas with a purity of 99.99% to normal atmospheric pressure to complete once Washing process. The gas washing process was repeated three times, and the high-purity argon...

Embodiment 2

[0031] The Sn-Bi-In-Zn-Ga low-melting point high-entropy alloy lead-free solder of this example has the following components and atomic mole percentages: 20.0% for Sn, 20.0% for Bi, 20.0% for In, and 20.0% for Zn , Ga is 20.0%, and the preparation steps are as follows: prepare 100 g of raw materials Sn, Bi, In, Zn, and Ga with a purity greater than 99.99% according to equal atomic mole percentages. Put the prepared raw materials into the corundum crucible in order of melting point from high to low, and the element with the lowest melting point is on the top layer. Put the corundum crucible filled with the alloy material into the spiral induction coil in the high vacuum induction melting casting furnace, vacuumize with a mechanical pump for 20 minutes, turn off the vacuum pump and fill it with high-purity argon gas with a purity of 99.99% to normal atmospheric pressure to complete once Washing process. The gas washing process was repeated three times, and the high-purity argon...

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Abstract

The invention discloses a Sn-Bi-In-Zn-Ga low-melting point high-entropy alloy lead-free solder and its preparation method and application. The Sn-Bi-In-Zn-Ga low-melting point high-entropy alloy lead-free solder, In terms of mole percentage, its composition is as follows: 20.0% of Sn, 20.0% of Bi, 20.0% of In, 20.0% of Zn, and 20.0% of Ga. The preparation is that after smelting, the alloy ingot is obtained by direct pouring, the preparation is simple, the preparation process has low energy consumption, no pollution, and is easy to control. The present invention adopts five low-melting-point elements Sn, Bi, In, Zn, and Ga to design the non-alcoholic element according to the formula of equiatomic ratio (Sn:Bi:In:Zn:Ga=1:1:1:1:1). Lead solder, thanks to the special delayed diffusion effect and cocktail effect of high-entropy alloys, finally obtains a new type of low-temperature lead-free solder with a melting point below 80°C. Well, suitable for 3D IC brazing welding process requirements.

Description

technical field [0001] The invention relates to a solder in the technical field of soldering materials, in particular to a Sn-Bi-In-Zn-Ga low-melting-point high-entropy alloy lead-free solder and its preparation method and application. Background technique [0002] With the rapid development of 5G technology, telecommuting and online teaching have become possible. People have a higher demand for smart mobile devices around them, such as more functions, faster response speed, smaller space and cheaper prices, so that the electronic packaging manufacturing industry is facing severe challenges. The warping problem of silicon wafers at high temperature and the reliability of solder joints need to be solved urgently. Therefore, it is very important to develop a new type of solder with low melting point, good mechanical properties and slow growth rate of IMC (intermetallic compound). [0003] In addition, the trend of Moore's Law in terms of miniaturization is approaching the lim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/24B23K35/40
CPCB23K35/24B23K35/40
Inventor 徐先东张天宇陈江华
Owner HUNAN UNIV