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A grinding process and preparation method for large-scale products of multilayer ceramic capacitors

A multi-layer ceramic and grinding process technology, applied in capacitor manufacturing, capacitors, ceramic molding machines, etc., can solve problems such as affecting product performance and quality, electrode extraction cannot be guaranteed, and the surface is easily contaminated by foreign objects, so as to improve the appearance of qualified rate, achieve large-scale mass production, and prevent the effect of product surface discharge

Active Publication Date: 2022-04-29
厦门华信安电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve the problems of poor grinding consistency of large-scale products after traditional grinding process of MLCC products, electrode lead-out cannot be guaranteed, internal cracks of the product are easily caused, the surface is easily polluted by foreign objects, and the insulation performance is prone to decrease and surface discharge and other defects affect product performance and quality problem

Method used

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  • A grinding process and preparation method for large-scale products of multilayer ceramic capacitors
  • A grinding process and preparation method for large-scale products of multilayer ceramic capacitors
  • A grinding process and preparation method for large-scale products of multilayer ceramic capacitors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] The experimental product before sintering was roughly ground with manual sandpaper in advance, and 12 edges and eight corners were manually rough-ground with 1000 mesh SiC sandpaper, so that the 12 edges and eight corners of the product had a certain arc, and The product is undamaged. The appearance of the product after coarse grinding is as figure 1shown.

[0086] 1. The product is subjected to medium temperature treatment before sintering

[0087] The experimental product after coarse grinding of sandpaper is treated at a medium temperature of 725°C, and its operation curve is: the first program segment is from 30 °C to 120 °C at a constant speed, and the heating time is 3 hours; the second program segment is from 120 °C to 150 °C at a uniform speed , the heating time is 6h; the third program segment is from 150℃ to 210℃ at a constant speed, and the heating time is 6h; the fourth program segment is from 210℃ to 280℃, and the heating time is 6h; the fifth program seg...

Embodiment 2

[0096] The experimental product before sintering was roughly ground with manual sandpaper in advance, and 12 edges and eight corners were manually rough-ground with 1000 mesh SiC sandpaper, so that the 12 edges and eight corners of the product had a certain arc, and The product is undamaged.

[0097] 1. The product is subjected to medium temperature treatment before sintering

[0098] The experimental product after coarse grinding of sandpaper is treated at a medium temperature of 625°C, and its operation curve is: the first program segment is from 30 °C to 120 °C, and the heating time is 3 hours; the second program segment is from 120 °C to 150 °C , the heating time is 6h; the third program segment is from 150℃ to 210℃ at a constant speed, and the heating time is 6h; the fourth program segment is from 210℃ to 280℃, and the heating time is 6h; the fifth program segment is 280℃, The holding time is 2 hours; the sixth program section is to raise the temperature from 280°C to 62...

Embodiment 3

[0107] The experimental product before sintering was roughly ground with manual sandpaper in advance, and the 12 edges and eight corners were manually rough ground with 1000 mesh SiC sandpaper, so that the 12 edges and eight corners of the product had a certain arc. And the product is not damaged.

[0108] 1. The product is subjected to medium temperature treatment before sintering

[0109] The experimental product after coarse grinding of sandpaper is treated at a medium temperature of 675°C, and its operation curve is: the first program segment is from 30 °C to 120 °C at a constant speed, and the heating time is 3 hours; the second program segment is from 120 °C to 150 °C at a uniform speed , the heating time is 6h; the third program segment is from 150℃ to 210℃ at a constant speed, and the heating time is 6h; the fourth program segment is from 210℃ to 280℃, and the heating time is 6h; the fifth program segment is 280℃, The holding time is 2 hours; the sixth program section...

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Abstract

The invention relates to the field of electronic component manufacturing, in particular to a grinding process and preparation method for large-scale products of multilayer ceramic capacitors. The grinding process includes the following process steps: S100, medium temperature treatment before sintering of the product: the treatment temperature is 625-725°C; S200, fine grinding on the machine after the medium temperature treatment: the grinding medium is white corundum powder, and the product and white The volume ratio of corundum powder is 1:2; its operation curve is: 4.5-5.5h at a speed of 4-8rpm, 4.5-5.5h at a speed of 14-18rpm, and 40-50h at a speed of 23-27rpm. It improves the overall quality of the product, ensures the consistency of the product, and improves the appearance qualification rate of the product; the internal micro-cracks of the product are reduced, and the loss tangent value is reduced; the surface smoothness of the product is increased, and the pressure resistance and reliability of the product are improved . Moreover, the production efficiency is improved, and a large-scale batch production of products is realized.

Description

technical field [0001] The invention relates to the field of electronic component manufacturing, in particular to a grinding process and preparation method for large-scale products of multilayer ceramic capacitors. Background technique [0002] MLCC (Multi-layer Ceramic Capacitors), also known as chip multilayer ceramic capacitors, is made of ceramic dielectric diaphragms with printed electrodes (internal electrodes) stacked in a dislocation manner, and a ceramic chip is formed by one-time high-temperature sintering, and then The metal layer (external electrode) is sealed at both ends of the chip to form a monolithic structure, so it is also called a monolithic capacitor. [0003] Traditional MLCC products need to be ground after sintering. Grinding is to add the sintered MLCC chip to the grinding medium to make a ratio with the chip, and grind the edges and corners of the product smoothly through the high-speed grinding machine to facilitate the sealing of the product. To ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B28B11/08H01G13/00
CPCB24B1/00B28B11/0845H01G13/00
Inventor 黄作权吴江涛徐长春黎清乐
Owner 厦门华信安电子科技有限公司
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