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Thermally conductive composition, thermally conductive sheet and method for producing same

A manufacturing method and technology of thermal conductivity, which are applied in heat exchange materials, chemical instruments and methods, films/sheets without carriers, etc., can solve the problems of resin interface peeling and low resilience, and prevent interface peeling and resilience. excellent effect

Inactive Publication Date: 2021-06-18
FUJI POLYMER INDUSTRIES CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, conventional thermally conductive compositions and sheets have problems of low resilience and interfacial peeling of the resin due to stress near the surface of the thermally conductive particles.

Method used

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  • Thermally conductive composition, thermally conductive sheet and method for producing same
  • Thermally conductive composition, thermally conductive sheet and method for producing same
  • Thermally conductive composition, thermally conductive sheet and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] Hereinafter, it demonstrates using an Example. This invention is not limited to an Example.

[0070]

[0071] The thermal conductivity of the thermally conductive composition is measured by Hot Disk (according to ISO 22007-2). The thermal conductivity measuring device 11 is as figure 1 As shown in A, the sensor 12 made of polyimide film is sandwiched between two samples 13a and 13b of the thermally conductive composition, and a constant power is applied to the sensor 12 to cause constant heat release. Appreciation is performed on thermal characteristics. The front end 14 diameter of sensor 12 is 7mm, as figure 1 As shown in B, the electrode has a double helix structure, and the electrode 15 for applying current and the electrode for resistance value (electrode for temperature measurement) 16 are arranged in the lower part. The thermal conductivity was calculated by the following formula (mathematical formula 1).

[0072] [mathematical formula 1]

[0073] [mathem...

Embodiment 1~3

[0106] (1) Adhesive polymer

[0107] Use 20 to 30% by weight of methylhydrogenpolysiloxane, 1 to 10% by weight of γ-glycidoxypropyltrimethoxysilane represented by the above chemical formula (Chemical formula 1), and 1 to 10% by weight of the above chemical formula (Chemical formula 2). 0.1 to 1% by weight of octamethylcyclotetrasiloxane, 1 to 10% by weight of carbon black, and a commercially available adhesive polymer comprising a silicone polymer.

[0108] The tensile shear bond strength of the adhesive polymer to the aluminum plate is as shown in Table 1.

[0109] (2) Base polymer

[0110] As the base polymer, a commercially available two-component room temperature curing silicone polymer was used. A base polymer component and a platinum-based catalyst were previously added to liquid A of the two-component room temperature curing silicone polymer, and a base polymer component and a crosslinking component were added to liquid B in advance.

[0111] The tensile shear bond s...

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Abstract

The invention relates to a thermally conductive composition 26 which contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W / m.K or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.

Description

technical field [0001] The present invention relates to a thermally conductive composition that is excellent in resilience and reduces interfacial peeling due to stress, a thermally conductive sheet using the same, and a method for producing the same. Background technique [0002] The performance of semiconductors such as CPUs has been dramatically improved in recent years, and the amount of heat released has also become enormous. Therefore, heat sinks are attached to electronic components that emit heat, and thermally conductive sheets are used to improve the adhesion between semiconductors and heat sinks. However, in recent years, along with downsizing and high performance of equipment, high thermal conductivity and low steady-state load value and soft properties are required for thermally conductive sheets. In Patent Document 1, it is proposed to improve compressibility, insulation, thermal conductivity, etc. by setting the viscosity of the thermally conductive silicone ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K13/02C08K3/22C08K3/04C08K5/5435C08K5/549C08J5/18C09K5/14
CPCC08L83/04C08J5/18C09K5/14C08K2003/2227C08J2383/07C08J2483/04C08J2483/05C08L2205/025C08L2205/03C08K13/02C08K3/22C08K3/04C08K5/5435C08K5/549C09J7/10C09J9/00C09J2301/408C08K3/36C08K3/28C09J2203/326
Inventor 神谷优希服部真和松村知树铃村克之中西浩二山口绫子
Owner FUJI POLYMER INDUSTRIES CO LTD