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High-efficiency cooling back plate device used for liquid crystal semiconductor film forming

A semiconductor, high-efficiency technology, applied in heat exchange equipment, lighting and heating equipment, indirect heat exchangers, etc., can solve the problem of easy damage to the target, to improve the effect of heat exchange, improve the efficiency of heat exchange, improve The effect of service life

Pending Publication Date: 2021-06-18
京浜乐梦金属科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a high-efficiency cooling backplane device for liquid crystal semiconductor film formation, so as to solve the problem that the target material is easily damaged when encountering high temperature in the above-mentioned background technology

Method used

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  • High-efficiency cooling back plate device used for liquid crystal semiconductor film forming
  • High-efficiency cooling back plate device used for liquid crystal semiconductor film forming
  • High-efficiency cooling back plate device used for liquid crystal semiconductor film forming

Examples

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Effect test

Embodiment 1

[0022] see Figure 1-4 , the present invention provides a technical solution: a high-efficiency cooling backplane device for liquid crystal semiconductor film formation, please refer to figure 1 , including a cooling backplane 6 and a cooling box 7, a target 4 is arranged above the cooling backplane 6, and the target 4 is movably connected to the cooling backplane 6, and through the cooperation between the cooling backplane 6 and the target 4, The heat on the target material 4 can be effectively transferred, and then the heat dissipation of the target material 4 can be effectively facilitated.

[0023] see figure 1 , the cooling back plate 6 is arranged above the cooling box 7, the cooling back plate 6 is movably connected with the cooling box 7, and the cooling box 7 provided can effectively facilitate the storage of cooling water, and then can effectively perform heat exchange, and then can effectively It is convenient for the target material 4 to dissipate heat, and then ...

Embodiment 2

[0031] Such as Figure 4As shown, the difference from the previous embodiment 1 is that a fixed sleeve 125 is provided above the coupling 123, and the fixed sleeve 125 is sleeved on the outer wall of the movable rod 126. Both ends of the casing 125 are fixedly connected with fixed rods 124, and the fixed rods 124 are fixedly connected with the inner wall of the box body 121. Through the cooperation between the fixed rods 124 and the fixed sleeves 125, the stability of the movable rod 126 can be effectively increased. , and then can effectively ensure that the stirring mechanism can work stably.

[0032] Such as figure 1 As shown, the top inner wall of the cooling box 7 is uniformly provided with multiple sets of fins 2, the fins 2 are fixedly connected with the cooling box 7, and the inner wall of the cooling box 7 is evenly provided with multiple sets of fins at the position matching with the permanent magnet 5 One 1, the fin one 1 is fixedly connected with the cooling box ...

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Abstract

The invention discloses a high-efficiency cooling back plate device used for liquid crystal semiconductor film forming in the technical field of semiconductor production. The high-efficiency cooling back plate device comprises a cooling back plate and a cooling box, a target material is arranged above the cooling back plate, the cooling back plate is arranged above the cooling box, the end face of the left side of the cooling box is fixedly connected with a water inlet pipeline communicating with an inner cavity, a water inlet flange plate is fixedly connected to a pipe opening of the water inlet pipeline, a water outlet pipeline communicating with the inner cavity is fixedly connected to the end face of the right side of the cooling box, and a water outlet flange plate is fixedly connected to a pipe opening of the water outlet pipeline. The cooling box comprises multiple sets of mounting grooves, each set of mounting groove comprises a containing plate, a permanent magnet is arranged on each set of containing plate, the containing plates are movably connected with the permanent magnets, the permanent magnets are in contact with the cooling back plate, two sets of monitoring chips are arranged in the cooling box, and multiple sets of turbulent flow mechanisms are arranged in the cooling box. The high-efficiency cooling back plate device aims to solve the problem that the target material is prone to being damaged when meeting high temperature.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a high-efficiency cooling backplane device for liquid crystal semiconductor film formation. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. , no matter from the perspective of technology or economic development, the importance of semiconductors is very huge. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. , common semiconductor materials include silicon, germanium, gallium arsenide, etc., silicon is the most influential one in the application of variou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D21/00F28F13/12F28F27/02
CPCF28D21/00F28F13/125F28F27/02F28D2021/0029
Inventor 松本光裕
Owner 京浜乐梦金属科技(苏州)有限公司
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