Temperature protection device based on ceramic heating plate heating system

Abstract

The invention relates to a temperature protection device based on a ceramic heating plate heating system. The device is characterized in that a ceramic heating plate is arranged at the upper end of a fixing base, a plurality of wafer positioning guide columns are uniformly distributed on the edge of the upper surface of the ceramic heating plate along the circumferential direction, a sealing plate is arranged at the lower end of the fixing base, an elastic contact temperature protection mechanism corresponding to the heating area of the ceramic heating plate is mounted on the sealing plate; and the elastic contact temperature protection mechanism comprises a temperature switch fixing base, elastic supporting columns and a resettable temperature switch, wherein the resettable temperature switch is installed on the temperature switch fixing base, a temperature sensing contact on the resettable temperature switch abuts against the ceramic heating plate to form a detection area, the elastic supporting columns are evenly distributed on the periphery of the resettable temperature switch, the lower end of each elastic supporting column is installed on the sealing plate, and the upper end of each elastic supporting column provides elastic support for the temperature switch fixing base. The ceramic heating plate is in non-fixed contact with the elastic contact temperature protection structure, and the contact surface is elastically supported, so that the contact is reliable; and the non-fixed over-temperature protection structure can ensure the process of the ceramic heating plate and save the cost.

Description

technical field [0001] The invention belongs to the field of wafer heat treatment technology in semiconductors, in particular to a temperature protection device based on a ceramic heating plate heating system. Background technique [0002] In the Track (coating and developing machine) machine used in the manufacture of semiconductor chips and liquid crystal displays, a layer of photosensitive material is coated on the substrate, and then undergoes a series of process steps, such as exposure with a photolithography machine, photoresisting, etc. The mask plate, and then a series of processes such as developing, etching, and glue removal, etc., are repeated several times, and the process of finally transferring the desired pattern to the substrate is the basic process of semiconductor chip manufacturing. During this process, the heating plate is used to perform temperature treatment on the substrate repeatedly. According to Moore's law, and thanks to the advancement of EUV (ex...

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Problems solved by technology

[0003] In view of the above-mentioned problems existing in the heating of the existing ceramic heating plate, the purpose of the present invention is to provide a temperature protection device based on the heating system of the ceramic heating plate to solve the external temperature detection of the ceramic heating plate, thereby controlling the power of the heating circuit and prolonging the heating time of the ceramic. The life of the board and other issues

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