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Packaging cover plate and preparation method thereof, display panel and display device

A technology for encapsulating cover plates and cover plates, which is applied in semiconductor/solid-state device manufacturing, diodes, semiconductor devices, etc., to improve the display effect and service life, avoid black spots, and avoid erosion

Pending Publication Date: 2021-06-18
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present disclosure provide a package cover plate and its preparation method, a display panel and a display device, so as to solve or alleviate one or more technical problems in the prior art

Method used

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  • Packaging cover plate and preparation method thereof, display panel and display device
  • Packaging cover plate and preparation method thereof, display panel and display device
  • Packaging cover plate and preparation method thereof, display panel and display device

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preparation example Construction

[0092] Figure 4 It is a schematic flow chart of a method for manufacturing a package cover in an embodiment of the present disclosure. Such as Figure 4 As shown, the preparation method of the package cover plate may include:

[0093] S41, forming a cover plate structure layer;

[0094] S42. Form a spacer column structure on one side of the cover plate structure layer, the spacer column structure includes a first spacer column located on one side of the cover plate structure layer, and the first spacer column includes a water absorption structure;

[0095] S43, forming an auxiliary electrode layer on the side of the spacer structure away from the cover plate structure layer,

[0096] Wherein, the spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer.

[0097] In one embodiment, forming the spacer column structure on one side of the cover plate structure layer may include: forming a ...

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Abstract

The embodiment of the invention provides a packaging cover plate, a preparation method thereof, a display panel and a display device. The packaging cover plate comprises: a cover plate structure layer; a spacing column structure located on one side of the cover plate structure layer, wherein the spacing column structure comprises a first spacing column located on one side of the cover plate structure layer, and the first spacing column comprises a water absorption structure; and an auxiliary electrode layer located on the side, away from the cover plate structure layer, of the spacing column structure, wherein the spacing column structure is configured to prevent water vapor from diffusing towards the auxiliary electrode layer along the spacing column structure. According to the technical scheme, the spacing column structure can prevent water vapor from diffusing towards the auxiliary electrode layer along the spacing column structure, so that the water vapor is prevented from diffusing to the top electrode and the organic functional layer of the display substrate, black spots can be avoided, the display effect of the display panel is improved, and the service life of the display panel is prolonged.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular to a packaging cover plate and a preparation method thereof, a display panel and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED) is a display lighting technology that has gradually developed in recent years. Especially in the display industry, OLED display is considered to have a wide range of applications due to its advantages of high response, high contrast, and flexibility. Application prospects. The top-emitting OLED display device has become the main direction of research because of its higher aperture ratio. For the top-emitting OLED structure, the top electrode as the light-emitting surface of the OLED must have good light transmittance. At present, materials such as thin metal, indium tin oxide, and indium zinc oxide are mostly used for top-emitting transparent electrodes. Due to the poor transmittance of metal, it is easy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/80522H10K59/874H10K59/8723H10K59/38H10K50/846H10K59/00H10K71/00H10K50/824H10K50/8428
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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