A wire bonding machine for improving welding accuracy

Abstract

The invention provides a wire welding machine for improving welding accuracy, including a temperature control system and a bond head structure; wherein, the bond head structure includes a bond head main body, a voice coil motor, and a transducer; the voice coil motor and one end of the bond head main body Mechanical connection, the transducer is installed on the other end of the main body of the head. A heating sheet is provided on the top or bottom of the main body of the bund, and the heating sheet covers the top or bottom of the main body of the bun. The length of the main body of the bund is greater than or equal to 1 / 2 of the overall length of the bund structure, or the main body of the bund is wrapped outside other components and the length of the main body of the bund is longer than 1 / 2 of the overall length of the bund structure. The wire welding machine for improving welding accuracy of the present invention has a relatively stable temperature value, which can effectively avoid thermal expansion and contraction of the bond head during operation, and improve welding accuracy.

Description

technical field [0001] The invention relates to the technical field of welding equipment, in particular to a wire welding machine. Background technique [0002] The wire bonding machine is one of the core processes in the back-end of semiconductor packaging, and the Bangtou is the most important part of the wire bonding machine, and it is the direct component for gold wire bonding. [0003] The existing wire bonding machine is heated by the heating plate located under the head, usually the heating plate needs to be heated to 250-300°C, and the head moves on various positions on the heating plate. However, due to the influence of the temperature of the heating plate in this traditional structure, when the bond head is at various positions on the heating plate, due to the uneven heating of the bond head, each module of the bond head will produce different degrees of thermal deformation (ie: The phenomenon of thermal expansion and contraction of the Bangtou) leads to a decreas...

AI Technical Summary

Problems solved by technology

However, due to the influence of the temperature of the heating plate in this traditional structure, when the bond head is at various positions on the heating plate, due to the uneven heating of the bond head, each module of the bond head will produce different degrees of thermal deformation (ie: The phenomenon of thermal expansion and contraction of the Bangtou), resulting in a decrease in the working accuracy of the Bangtou, thus affecting the positional accuracy of the final welding (Bonding) of the Bangtou

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