Application method of adhesive based on near-infrared curing
An application method and adhesive technology, applied in chemical instruments and methods, adhesives, adhesive additives, etc., can solve the problems of inability to meet industrial application requirements, limited UV curing depth, weak UV penetration, etc. The effect of low cost, fast bonding speed and high bonding strength
Inactive Publication Date: 2021-06-25
JIANGNAN UNIV
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the depth of UV curing is limited and it is difficult to cure colored systems. At present, adhesives are often used in fields such as chip security, integrated circuit chip sealing, IC encapsulation, and reinforcement of electronic circuits. Weak, can not penetrate thicker substrates or colored sheets, and thus cannot meet the requirements of industrial applications
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0032] The adhesive formula is as follows:
[0033]
[0034] Sheets A and B were black polypropylene plastic sheets of 0.5 cm and 1 cm thickness, respectively.
Embodiment 2
[0036] Using the formula as in Example 1, the components were mixed evenly to obtain a near-infrared adhesive, which was stored away from light. The adhesive is coated between the plastic sheets A and B, and then placed under ultraviolet light (400nm) and near-infrared light (980nm) to irradiate and cure.
Embodiment 3
[0038] The adhesive formula is as follows:
[0039]
[0040] Sheets A and B were both red glass sheets of 1 cm thickness.
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Abstract
The invention relates to an application method of an adhesive based on near-infrared curing, and belongs to the field of adhesives. The method comprises the following steps: step 1, mixing an up-conversion material, resin, a photoinitiator and a reactive diluent in proportion to prepare an adhesive; and step 2, coating the surface of a sheet A and / or the surface of a sheet B with the adhesive, bonding the sheet A and the sheet B for forming under irradiation of near-infrared light, so as to form a dark sandwich structure plate. The sheet A and / or the sheet B are / is a transparent glass sheet with the thickness smaller than 3 cm, a colored glass sheet with the thickness smaller than 1 cm, a transparent plastic sheet with the thickness smaller than 2 cm, a colored plastic sheet with the thickness smaller than 1 cm or wood with the thickness smaller than 3 mm. The adhesive is composed of an up-conversion material, resin, a photoinitiator and a reactive diluent. The structural plate is low in manufacturing cost, simple in process and high in bonding speed. The near-infrared light curing can realize the bonding of the plate, the thickness is large, and the bonding strength of the adhesive is high.
Description
technical field [0001] The invention relates to an application method of an adhesive based on near-infrared curing, and belongs to the field of adhesives. Background technique [0002] Light-curing technology has the advantages of fast curing, energy saving, and greenness. Light-curing adhesives are widely used in medical care, electronic components and daily life. However, the depth of UV curing is limited and it is difficult to cure colored systems. At present, adhesives are often used in fields such as chip security, integrated circuit chip sealing, IC encapsulation, and reinforcement of electronic circuits. Weak, unable to penetrate thicker substrates or colored sheets, and thus cannot meet the requirements of industrial applications. In order to solve the above problems, it is necessary to develop a technology that can realize rapid adhesion of colored systems. Contents of the invention [0003] Based on the above problems, the present invention provides a method fo...
Claims
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IPC IPC(8): B32B37/12B32B38/00C09J175/14C09J163/10C09J11/04
CPCB32B37/12B32B38/00C09J175/14C09J163/10C09J11/04B32B2037/1253B32B2038/0076
Inventor 刘仁孙冠卿皮玉红周宇凡
Owner JIANGNAN UNIV