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SMA-based dynamic modulus monitoring and feedback system

A technology of dynamic modulus and feedback system, applied in the field of alloy materials, to achieve the effect of broad application prospects

Active Publication Date: 2021-07-02
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a dynamic modulus monitoring and feedback system based on SMA, using SMA microwires as the core component of modulus measurement and control, to solve the lack of target monitoring in the prior art. The problem of real-time resolution and data feedback of the elastic modulus of the material

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0057]Build a dynamic modulus monitoring and feedback system based on SMA, using springs as the expansion and contraction sections in the restraints, the springs are spring wires or spring sheets, the fixed module is a metal or ceramic baffle with holes, and the baffle is in the form of blocks or sheets shape. Silicon carbide is used as the probe, one end of the probe is connected to the fixed module at one end of the constraint, and the other end of the probe runs through the fixed module at the other end of the constraint. The length of the probe is d 0 The diameter of the probe is 4mm, and the diameter of the probe is 0.3mm; the two ends of the driving telescopic element are respectively connected with the fixed modules at both ends of the restraining element, and the selected shape memory alloy wire is a nickel-titanium-based shape memory alloy wire, and its diameter is 30 microns, and the drive wire length matches the probe length.

[0058] First set the detection strok...

Embodiment 2

[0062] Build a dynamic modulus monitoring and feedback system based on SMA, using springs as the expansion and contraction sections in the restraints, the springs are spring wires or spring sheets, the fixed module is a metal or ceramic baffle with holes, and the baffle is in the form of blocks or sheets shape. Silicon carbide is used as the probe, one end of the probe is connected to the fixed module at one end of the constraint, and the other end of the probe runs through the fixed module at the other end of the constraint. The length of the probe is d 0 The diameter of the probe is 3.5mm, and the diameter of the probe is 0.3mm; the two ends of the driving telescopic element are respectively connected with the fixed modules at both ends of the restraining element, and the selected shape memory alloy wire is a nickel-titanium-based shape memory alloy wire. is 25 microns, and the drive wire length matches the probe length.

[0063] First set the detection stroke Δl of the pr...

Embodiment 3

[0067] Build a dynamic modulus monitoring and feedback system based on SMA, using springs as the expansion and contraction sections in the restraints, the springs are spring wires or spring sheets, the fixed module is a metal or ceramic baffle with holes, and the baffle is in the form of blocks or sheets shape. Silicon carbide is used as the probe, one end of the probe is connected to the fixed module at one end of the constraint, and the other end of the probe runs through the fixed module at the other end of the constraint. The length of the probe is d 0 The diameter of the probe is 3.0mm, and the diameter of the probe is 0.3mm; the two ends of the driving telescopic element are respectively connected with the fixed modules at both ends of the restraining element, and the selected shape memory alloy wire is a nickel-titanium-based shape memory alloy wire. is 50 microns, and the drive wire length matches the probe length.

[0068] First set the detection stroke Δl of the pr...

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Abstract

The invention provides an SMA-based dynamic modulus monitoring and feedback system. The SMA-based dynamic modulus monitoring and feedback system comprises the following components: a constraint piece comprises a telescopic section and fixing modules positioned at two ends of the telescopic section; one end of the probe is connected with the fixing module at one end of the constraint piece, and the other end of the probe penetrates through the fixing module at the other end of the constraint piece; the two ends of the driving telescopic piece are connected with the fixing modules at the two ends of the constraint piece respectively, and the driving telescopic piece is a shape memory alloy wire, is externally connected with a power source and is used for driving the telescopic section to contract through contraction so as to determine the current peak value of the external power source when the probe stretches out to reach the set detection stroke. The invention further provides an SMA-based dynamic modulus monitoring and feedback method. According to the SMA-based dynamic modulus monitoring and feedback system provided by the invention, an SMA microwire is used as a modulus measurement and control core element, the elastic modulus of a measured object can be directly reflected according to a current peak value in a pulse type driving process, and the test precision reaches 85% or above.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and relates to an SMA-based dynamic modulus monitoring and feedback system, in particular to a shape memory alloy (SMA)-based miniature real-time dynamic modulus monitoring and feedback testing system. Background technique [0002] In the small strain range, the material is in the elastic deformation stage. At this time, the stress and strain are generally proportional, and the proportional coefficient is called the elastic modulus. The elastic modulus is usually used to indicate the hardness or softness of the material or the difficulty of deformation, and it is one of the key engineering parameters. On the one hand, it is used as an important criterion for engineering material selection, or it can also be used to judge the properties of materials. There are three main traditional testing methods for elastic modulus: static wave, wave propagation method and dynamic method. The specific...

Claims

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Application Information

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IPC IPC(8): G01N3/02
CPCG01N3/02G01N2203/0075
Inventor 金明江金学军
Owner SHANGHAI JIAO TONG UNIV
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