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Welding quality processing method and device and circuit board

A welding quality and processing method technology, which is applied in the field of circuit boards, welding quality processing methods and devices, can solve problems such as damaging circuit boards, failing to find problems in time, and affecting the yield of circuit boards, so as to achieve the effect of ensuring welding quality

Active Publication Date: 2021-07-02
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Multi-layer circuit boards such as sandwich circuit boards are usually composed of a bottom plate, an adapter plate, and a top plate. After-the-fact measurement, and to judge the degree of internal warpage, it may be necessary to destroy the circuit board structure for measurement
Failure to detect problems in time will affect the yield of the corresponding batch of circuit boards

Method used

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  • Welding quality processing method and device and circuit board
  • Welding quality processing method and device and circuit board
  • Welding quality processing method and device and circuit board

Examples

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Embodiment Construction

[0040] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0041] figure 1 is a flow chart of a welding quality processing method shown in an embodiment of the present disclosure, as shown in figure 1 shown, including the following steps:

[0042] S1. Obtain the warpage data of each layer of the multilayer circuit board under the preset welding temperature change curve.

[0043] S2. According to the stacking state of the multilayer circuit ...

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Abstract

The invention relates to a welding quality processing method and device and a circuit board. The method comprises the following steps: acquiring warping data of each layer of circuit board in the multi-layer circuit board under a preset welding temperature change curve; according to the stacking state of the multilayer circuit board and the warping data simulation, generating a warping level of each area of the multilayer circuit board in the stacking state; and processing the multilayer circuit board according to the warping level. Through adoption of the method, before actual welding, the warping level of the circuit board in the welding process can be obtained, the warping risk can be judged, the warping risk can be dynamically analyzed, processing is carried out based on the warping level, and the welding quality of the circuit board is guaranteed.

Description

technical field [0001] The present disclosure relates to the field of welding technology, in particular to a welding quality processing method and device, and a circuit board. Background technique [0002] With the rapid development of 5G and other technologies, there are more and more components in mobile terminals. In order to complete the stacking of components in a limited space, the application of multi-layer circuit board stacking is becoming more and more common, as batteries or other functions of electronic equipment Modules provide greater installation space. Multi-layer circuit boards such as sandwich circuit boards are usually composed of a bottom plate, an adapter plate, and a top plate. Afterwards measurement, to judge the degree of internal warpage, it may be necessary to destroy the circuit board structure for measurement. Failure to detect problems in time will affect the yield of the corresponding batch of circuit boards. Contents of the invention [00...

Claims

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Application Information

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IPC IPC(8): H05K3/34G06F30/20G06Q10/06
CPCH05K3/34G06F30/20G06Q10/0635G06F2119/08H05K3/3494H05K2201/09136H05K2201/049H05K3/3436G01B11/254G01B11/306H05K3/0005H05K1/0271B23K2101/42G06F2115/12B23K1/0016B23K3/08H05K1/0298B23K31/125
Inventor 康振亚郭金保
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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