A mini-led chip capable of realizing uniform distribution of light and its preparation method
A mini-led, light-uniform technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting charge injection and extraction, potential difference of transparent conductive layer, inconsistent discoloration efficiency of LED chips, etc., to avoid serious light absorption and improve The effect of light extraction efficiency
Active Publication Date: 2022-01-25
XIAMEN CHANGELIGHT CO LTD
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Problems solved by technology
[0006] The purpose of the present invention is to provide a mini-LED chip capable of uniform light distribution and its preparation method, to solve the problem that the potential difference between the center and the edge of the transparent conductive layer affects the injection and extraction of charges, resulting in the unevenness of each area of the LED chip. The problem of inconsistent color changing efficiency
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[0046] In order to make the content of the present invention clearer, the content of the present invention will be further described below in conjunction with the accompanying drawings. The invention is not limited to this specific example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0047] Such as figure 1 , figure 2 and image 3 As shown, a mini-LED chip that can achieve uniform light distribution, including:
[0048] substrate1;
[0049] An epitaxial stack 4, an undoped layer 5, and a second-type semiconductor thin layer 6 are sequentially stacked on the surface of the substrate 1. The epitaxial stack 4 includes a first-type semiconductor layer 4.1 and an active region 4.2 stacked in sequence along the first direction. and the second type semiconductor layer 4.4; etch along the surface of the second ty...
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The present invention provides a mini-LED chip capable of uniform light distribution and a preparation method thereof, by sequentially stacking an epitaxial stack, a non-doped layer, and a second-type semiconductor thin layer on the surface of a substrate; at the same time, in the first The surface of the second-type semiconductor thin layer is provided with a transparent conductive layer, and the transparent conductive layer is in contact with the second-type semiconductor layer by means of groove embedding, and the insulating layer is attached to the side wall of the through hole and extending to part of the surface of the transparent conductive layer. So that when the current is injected from the electrode, it spreads evenly to the second type semiconductor layer through the groove, thereby reducing the potential difference between the center and the edge of the transparent conductive layer, so that the current can be distributed evenly, avoiding mini ‑LEDs experience current crowding.
Description
technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a mini-LED chip capable of realizing uniform light distribution and a preparation method thereof. Background technique [0002] A light-emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. LED has the advantages of high efficiency, long life, small size, low power consumption, etc., and can be used in indoor and outdoor white light lighting, screen display, backlight and other fields. In particular, the rapid development of display technology makes the market demand for Mini-LED chips develop rapidly, and also promotes the technological development of Mini-LED. Most Mini-LEDs use a transparent substrate + flip-chip soldering structure. If it is directly applied to a display screen, the requirements for the uniformity of light emission of the entire chip will be significantly improved, so that the cur...
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IPC IPC(8): H01L33/38H01L33/42H01L33/00
CPCH01L33/382H01L33/42H01L33/005
Inventor 林志伟陈凯轩蔡建九曲晓东赵斌
Owner XIAMEN CHANGELIGHT CO LTD