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A kind of manufacturing method of half plug hole of printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of printed circuits, printed circuits, and the formation of electrical connections of printed components, and can solve problems such as dirty cleaning, difficulty in controlling the thickness of half plug holes, and cumbersome manufacturing steps, and achieve simple steps , Thickness controllable, solve the effect of cleaning unclean

Active Publication Date: 2022-02-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a method for manufacturing a half-plug hole in a printed circuit board in view of the problems in the prior art that the thickness of the half-plug hole is difficult to control, the manufacturing steps are cumbersome, and the cleaning is not clean.

Method used

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  • A kind of manufacturing method of half plug hole of printed circuit board

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Embodiment Construction

[0036] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0037] The first aspect of the present invention provides a method for manufacturing a half plug hole of a printed circuit board, comprising the following steps:

[0038] S1: Place the screen sheet 1 under the printed circuit board after the metallization of the through hole, the screen sheet 1 is provided with a mesh 2 at the position corresponding to the through hole, and in the through hole Print plugging ink 3;

[0039] S2: heating the printed circuit board and the screen sheet at 110°C-130°C, keeping warm and cooling, so as to use capillary phenomenon to remove part of the plugging ink to control the thickness of the half plugging hole;

[0040] S3: removing the screen sheet, heating the printed circuit board ...

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Abstract

The invention relates to a method for manufacturing a half plug hole of a printed circuit board, belonging to the technical field of circuit board production. The present invention puts a layer of screen under the printed circuit board when making the plug hole, strictly controls the temperature, and controls the depth of the half plug hole through the capillary phenomenon, which solves the problem that the depth is difficult to control and the steps are difficult in the existing half plug hole manufacturing process. The problem of cumbersome and unclean cleaning has simplified the production steps and improved the product qualification rate.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for manufacturing a half plug hole of a printed circuit board. Background technique [0002] With the development of electronic products in the direction of miniaturization and multi-function, the printed circuit boards used are also developing in the direction of high-layer count and high density. ten floors. Printed circuit board layers are not connected between layers, and they need to be drilled and metalized to make them conduct with each other. According to the conduction situation, the holes can be divided into through holes, blind holes and buried holes. During the surface mount (SMT) process, there may be the following problems: (1) solder may penetrate through the via hole and cause a short circuit; (2) flux may remain in the via hole; (3) solder paste may flow into the via hole and False soldering is caused in the blind hole, res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
CPCH05K3/40H05K2201/09818
Inventor 周国云李明瑞何为王守绪陈苑明杨文君张伟华苏新虹
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA