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Manufacturing method of double-sided aluminum substrate

A manufacturing method and technology for aluminum substrates, which are applied in chemical/electrolytic methods to remove conductive materials, manufacture printed circuits, and manufacture printed circuit precursors, etc., which can solve the problems of difficult heat dissipation and high power, and achieve good performance in many aspects. Effect

Inactive Publication Date: 2021-07-20
江门市奔力达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a double-sided aluminum substrate manufacturing method, which has the advantages of good performance in heat dissipation, thermal expansion, electrical insulation, etc., and solves the problems of high power and difficult heat dissipation faced by double-sided and multi-layer boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Pure aluminum plate: the aluminum plate is made of materials with high aluminum content; drilling 1: use the principle of concentric circles to design the drill belt, drill out PTH holes, plate edge tool holes, rivet holes, and target holes after pressing; aluminum surface drawing: aluminum plate The surface is machined with mechanical friction to process straight lines; pressing: the copper foil, prepreg, and aluminum plate are pressed into a whole through a laminator using high temperature and high pressure; drilling 2: the coefficient needs to be confirmed before drilling, and the PTH hole after filling the glue is drilled , tool holes on the edge of the board; sinking copper plate: after grinding the board, it is necessary to seal the edge and sink the copper, and tear the single side for conductive plate bonding after sinking the copper; double-sided circuit production: after developing, the edge needs to be sealed and etched to prevent the aluminum plate from being ...

Embodiment 2

[0043] In embodiment one, add following operation:

[0044] In step 1, pure aluminum has low density, can be strengthened, easy to process, corrosion resistance, and good thermal conductivity.

[0045] Pure aluminum plate: the aluminum plate is made of materials with high aluminum content; drilling 1: use the principle of concentric circles to design the drill belt, drill out PTH holes, plate edge tool holes, rivet holes, and target holes after pressing; aluminum surface drawing: aluminum plate The surface is machined with mechanical friction to process straight lines; pressing: the copper foil, prepreg, and aluminum plate are pressed into a whole through a laminator using high temperature and high pressure; drilling 2: the coefficient needs to be confirmed before drilling, and the PTH hole after filling the glue is drilled , tool holes on the edge of the board; sinking copper plate: after grinding the board, it is necessary to seal the edge and sink the copper, and tear the s...

Embodiment 3

[0047] In embodiment two, add following operation:

[0048] In step 2, increase the hole under the large PAD of the line, and use PP glue to flow and cure to increase the bonding force between layers.

[0049] Pure aluminum plate: the aluminum plate is made of materials with high aluminum content; drilling 1: use the principle of concentric circles to design the drill belt, drill out PTH holes, plate edge tool holes, rivet holes, and target holes after pressing; aluminum surface drawing: aluminum plate The surface is machined with mechanical friction to process straight lines; pressing: the copper foil, prepreg, and aluminum plate are pressed into a whole through a laminator using high temperature and high pressure; drilling 2: the coefficient needs to be confirmed before drilling, and the PTH hole after filling the glue is drilled , tool holes on the edge of the board; sinking copper plate: after grinding the board, it is necessary to seal the edge and sink the copper, and te...

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Abstract

The invention discloses a manufacturing method of a double-sided aluminum substrate. The manufacturing method comprises steps of preparing a pure aluminum plate, wherein the aluminum plate is made of a high-aluminum-content material; drilling a hole 1: designing a drilling belt according to the principle of concentric circles, and drilling a PTH hole, a plate edge tool hole, a rivet hole and a target position hole after pressing; aluminum surface wire drawing: machining linear lines on the surface of the aluminum plate by mechanical friction; pressing: pressing the copper foil, the prepreg and the aluminum plate into a whole by using high temperature and high pressure through a laminating machine; drilling a hole 2, wherein coefficients need to be confirmed before drilling. The method has the beneficial effects that the PTH hole and the plate edge tool hole after glue filling are drilled; electroless copper plating is performed, namely edge sealing and electroless copper plating are performed after the plate is ground, and a single edge is torn to perform conductive plating after electroless copper plating. According to the manufacturing method of the double-sided aluminum substrate, the problems of high power and difficult heat dissipation of a double-sided board and a multi-layer board are solved by arranging the pure aluminum board and manufacturing the double-sided circuit, and the manufacturing method of the double-sided aluminum substrate has the advantages of good heat dissipation performance, thermal expansion performance, electrical insulation performance and the like.

Description

technical field [0001] The invention relates to the technical field of manufacturing aluminum substrates, in particular to a method for manufacturing double-sided aluminum substrates. Background technique [0002] With the popularization and wide application of electronic products, the technology of using metal substrates to make printed circuit boards is also constantly updated and developed; for example, in order to meet the development and needs of various electronic products, printed circuit boards based on aluminum substrates have been From single-sided aluminum substrate to double-sided aluminum substrate or multi-sided aluminum substrate, the production of aluminum substrate directly drives the rapid development of heat dissipation products in the industry. Due to its good performance in heat dissipation, thermal expansion, and electrical insulation, it can solve the problem Many problems faced by double-sided and multi-layer boards, such as: high power and difficult ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02H05K3/06H05K3/28
CPCH05K3/0047H05K3/022H05K3/06H05K3/282
Inventor 黎一鹏谢宇光张勇钟华爱
Owner 江门市奔力达电路有限公司
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