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Automatic laminating equipment for optical fiber base lens and laminating method of automatic laminating equipment

A technology for laminating equipment and lenses, applied in the direction of mechanical equipment, material gluing, connecting components, etc., can solve the problems of not being able to directly use wafer rings, bulky equipment, and high energy consumption, so as to improve convenience, reduce processing procedures, The effect of convenient machine adjustment

Pending Publication Date: 2021-07-23
东莞市正远智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to solve the problem that the existing equipment cannot directly use the crystal element ring by providing an automatic lamination equipment and lamination method for optical fiber base lenses, and that an additional process needs to be designed, resulting in bulky equipment and high energy consumption. And the problem of low efficiency, it adopts fully automatic control, no human intervention is required in the operation process, which not only improves the work efficiency, but also improves the placement accuracy

Method used

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  • Automatic laminating equipment for optical fiber base lens and laminating method of automatic laminating equipment
  • Automatic laminating equipment for optical fiber base lens and laminating method of automatic laminating equipment
  • Automatic laminating equipment for optical fiber base lens and laminating method of automatic laminating equipment

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Embodiment 1

[0038] A kind of optical fiber base lens automatic bonding equipment provided in this embodiment 1, such as Figure 1~5 As shown, it includes a frame 1, a dispensing mechanism 2, a patch mechanism 3 and a calibration fixture 4. A cavity is arranged in the frame 1, and the glue dispensing mechanism 2, the patch mechanism 3 and the calibration fixture 4 are all installed in the container. In the cavity, the glue dispensing mechanism 2 includes a trough guide rail 21, a glue dispensing head 22 and a first vision module 23. The glue dispensing head 22 is arranged above the material trough guide rail 21, and the first vision module 23 is used to detect the point of the product. Glue position; the placement mechanism 3 includes a wafer tray 31, a placement head 32 and a second vision module 33, the placement head 32 is arranged above the wafer tray 31, and the second vision module 33 is used to detect the placement of the product The position of the film; the correction jig 4 is use...

Embodiment 2

[0045] Embodiment 2 provides a bonding method for optical fiber base lenses, which uses the automatic bonding equipment for optical fiber base lenses in Embodiment 1 to realize automatic bonding of optical fiber bases and lenses, as follows:

[0046] Connect the fiber base lens automatic bonding equipment with the feeding vibrating plate;

[0047] Adjust the chute width of the first chute rail 211, the second chute rail 212 and the third chute rail 213;

[0048] Convey the product to the second chute rail 212 through the first chute rail 211, and the first pneumatic push rod 7 is activated to push the product forward in a straight line in the second chute rail 212;

[0049] The first vision module 23 continuously detects the dispensing position of the product directly below the dispensing head 22, and controls the movement of the dispensing head 22 to complete the dispensing operation;

[0050] The second vision module 33 detects the position of the lens, the mounter head 32 ...

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Abstract

The invention belongs to the technical field of optical fiber base product structures, and particularly discloses automatic laminating equipment for an optical fiber base lens and a laminating method of the automatic laminating equipment. The automatic laminating equipment comprises a rack, a dispensing mechanism, a chip mounting mechanism and a correction jig, wherein the dispensing mechanism comprises a trough guide rail, a dispensing machine head and a first vision module, and the first vision module is used for detecting the dispensing position of a product; the chip mounting mechanism comprises a wafer tray, a chip mounting machine head and a second vision module, and the second vision module is used for detecting the chip mounting position of the product; and the correction jig is used for correcting the position of the lens. The automatic laminating equipment adopts the visual positioning and detection technology to respectively assist the dispensing machine head in completing dispensing operation and the chip mounting machine head in completing chip mounting operation, can directly adopts wafer lens materials, and machining procedures are reduced. The production efficiency of the product is improved, the convenience of equipment programming and debugging is greatly improved, the dispensing and chip mounting effects of the product can be conveniently detected, and the chip mounting precision of the product is improved. The use is simple, the machine adjustment is convenient, and the processing capacity and efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of optical fiber base product structure, and in particular relates to an optical fiber base lens automatic bonding device and a bonding method thereof. Background technique [0002] Photoelectric conversion products need to paste a lens on the inner groove. When attaching the lens, a drop of glue must be dropped on the surface of the groove first, and then the lens should be clamped with tweezers and stuck in the groove. Due to the small size of the groove, the operation is difficult. Some equipment rely on human assistance in the process of operation and use, and all of them adopt semi-automatic type, which not only has low efficiency, but also has poor placement accuracy; at the same time, because the lens materials provided by the supplier are in the form of wafer rings, the existing equipment cannot Direct use of the wafer ring requires an additional process to import the lens from the wafer ring into th...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10B05C13/02B05C9/14F16B11/00
CPCB05C5/02B05C9/14B05C11/10B05C11/1015B05C13/02F16B11/006
Inventor 刘明伟黄古刚赵军叶建青
Owner 东莞市正远智能装备有限公司