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A kind of polishing method of 1 inch germanium processing sheet

A technology for processing wafers and polishing liquids. It is applied to metal processing equipment, surface polishing machine tools, grinding/polishing equipment, etc. It can solve the problems of high speed of large disks and ceramic disks, poor surface flatness, and high consumption of liquid medicine. , to reduce the cost of polishing liquid, reduce liquid consumption, and improve polishing quality.

Active Publication Date: 2022-02-22
中锗科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing 1-inch germanium processing wafer has a low removal rate in the polishing process, consumes a lot of chemical solution, and the surface flatness is not good, and the yield is low. At the same time, the large plate and the ceramic plate rotate at a high speed during the polishing process, which is easy to deviate

Method used

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  • A kind of polishing method of 1 inch germanium processing sheet
  • A kind of polishing method of 1 inch germanium processing sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Processing customer 1 inch order, 1008 pieces 1 inch germanium:

[0030] Preparation of the polishing fluid is: After mixing the silica polishing fluid, sodium bicarbonate and pure water, the sodium chlorite to the polishing liquid is 5.9 g / L, and finally the pH of sodium hydroxide to the polishing fluid is 10.1. Where each 1 ml of silica polishing is required to 0.75 g sodium carbonate and 50 ml of water.

[0031] The equipment used is created 50B, the large disk diameter is 1300mm, the ceramic disk diameter is 485mm; the arrangement of 1 inch germanium processing on the ceramic dish is like figure 2 As shown, a ceramic disc is arranged in a 63-inch germanium processing sheet along the periphery, and the lower surface of each ceramic plate is posted with a 1 inch germanium processing sheet. There are 7 1 inch germanium processing tablets per group. 1 inch germanium per group. The arrangement is arranged in the middle, and the remaining six in the middle of the 6-inch ger...

Embodiment 2

[0042] Processing customer 1 inch order, 1008 pieces 1 inch germanium:

[0043] As in Example 1, the difference is: when the preparation of the polishing fluid, the sodium chlorite to the polishing liquid is 5.95 g / L, and finally the pH of sodium hydroxide to the polishing fluid is 10.15; after all processing is completed According to statistics, the finished product rate is 96.9%, the drop rate is about 1.2 um / s, and 10 pieces of surface is 5 o'clock in 1-2 um, and the polishing liquid is consumed 260L, and 0.258L / piece is equipped with 0.258L / piece, and there is no running piece.

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PUM

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Abstract

The invention discloses a polishing method for a 1-inch germanium processing sheet. The chlorine content in the polishing liquid used is 5.5-6.0 g / L, and the pH value is 10.0-10.2; The rotation speed of the ceramic disc and the large disc are both 38-42rpm, and the spraying amount of the polishing liquid is 1500-2000ml / min; during fine polishing, the rotating speed of the ceramic disc and the large disc is 38-42rpm, and the spraying amount of the polishing liquid is 800-1200ml / min. min; during rough polishing and fine polishing, the downward pressure exerted by the rotor on the ceramic disc is 1000-1200N. The polishing method of the 1-inch germanium processing sheet of the present invention improves the shedding rate, improves the polishing efficiency and polishing quality; reduces the consumption of the chemical solution, reduces the cost of the polishing solution; reduces the chance of running the film, and improves the stability of the polishing. The utilization efficiency of the equipment is improved; the yield rate is improved, the flatness of the product is improved, the uniformity is good, the surface damage of the wafer is small, the impurities and particles are less sticky and dirty after polishing, and it is easy to clean.

Description

Technical field [0001] The present invention relates to a polishing method of 1 inch germanium processing sheet, belonging to 1 inch germanium polishing technology. Background technique [0002] During the polishing process of 1 inch germanium processing, CMP mechanical polishing will generally be used. The CMP large polishing apparatus in the industry is mainly used in 4 inches, 6 inches, 8 inches, 12 inches and other large diameter wafers. For 1 inch wafer having a small size, a small device is polished, and the large disk diameter of the small device is generally 660 mm or 830 mm, and the ceramic dish is generally 305 mm or 355 mm. Due to the deeper damage between the front and corrosion processes, the polishing process time will be relatively long. The polishing process of the existing 1 inch germanium processing sheet is low, the liquid consumption is consumed, and the surface flatness is not good, the product is low, and the polishing process is high, and the ceramic speed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B29/02B24B49/00B24B41/06B24B57/02
CPCB24B29/02B24B49/006B24B41/068B24B57/02
Inventor 端平曾琦江云刘兴达胡丽平柯尊斌王卿伟
Owner 中锗科技有限公司
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