Surface grinding method for circuit board processing
A circuit board and grinding mechanism technology, which is applied to metal processing equipment, machine tools suitable for grinding workpiece planes, grinders, etc. and other problems to avoid adverse effects, avoid the impact of measurement accuracy, and avoid contamination.
Active Publication Date: 2021-07-27
鹤山源昌电子科技有限公司
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Problems solved by technology
[0003] In the production process of circuit boards, the common process is to polish the surface of the circuit board. The existing surface grinding method for circuit board processing is not easy to clean the polished debris in time, resulting in the debris easily attached to the circuit board. The surface of the board will not only affect the use of the circuit board, but also cause adverse interference to the subsequent polishing of the circuit board
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0033] Such as Figure 1-10 As shown, the present invention provides a surface grinding device for circuit board processing, including a support mechanism 1, a moving mechanism, a clamping assembly 7 and a dust suction mechanism 3 are arranged on the supporting mechanism 1, and a grinding mechanism 2 is fixed on the bottom of the moving mechanism; The mechanism 2 is located directly above the support mechanism 1; the dust collection mechanism 3 includes a dust...
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The invention belongs to the technical field of circuit board processing, and discloses a surface grinding method for circuit board processing. According to the surface grinding method for circuit board processing, through the mutual cooperation of a grinding part, a polishing part, an air blower and the like, chippings ground by a grinding mechanism are timely and effectively sucked into a dust collecting box to be stored, so that pollution of the chippings to the surrounding environment is avoided; and protection liquid can be sprayed on the surface of a circuit board through a device, so that the processing effect of the device on the circuit board is improved.
Description
technical field [0001] The invention belongs to the technical field of circuit board processing, in particular to a surface grinding method for circuit board processing. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit board, printed circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board. The board is the flexible circuit board and the rigid circuit board. After lamination and other processes, they are combined according to the relevant process requirements to form a circuit boar...
Claims
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Login to View More IPC IPC(8): B24B7/10B24B27/00B24B41/06B24B41/02B24B47/14B24B41/04B24B47/12B24B55/06B24B55/12B24B51/00B24B49/04B24B55/00B24B1/00
CPCB24B7/10B24B27/0076B24B41/06B24B41/02B24B47/14B24B41/04B24B47/12B24B55/06B24B55/12B24B51/00B24B49/045B24B55/00B24B1/00
Inventor 武鑫
Owner 鹤山源昌电子科技有限公司