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Heat-conducting gasket and preparation method thereof

A technology of thermally conductive gasket and thermally conductive film, applied in chemical instruments and methods, modification by conduction heat transfer, cooling/ventilation/heating transformation, etc. question

Pending Publication Date: 2021-07-30
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method obtains a thermally conductive material. Although a high thermal conductivity can be obtained in the longitudinal direction, due to the rough surface, a large number of gaps between the folds, and the hardness of the graphene film itself, it cannot fully contact the interface. Larger, not suitable as thermal pad material
In addition, although the above-mentioned documents all assume that the graphene heat conduction film is directly applied to the longitudinal heat conduction, it is not suitable for the heat conduction interface due to the large thermal resistance and the limited heat dissipation effect.

Method used

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  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof

Examples

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Effect test

preparation example Construction

[0056] An exemplary method for preparing the thermal pad of the present invention includes the following steps:

[0057] (1) Form a plurality of holes 11 through the upper and lower surfaces of the thermally conductive film 10 on the thermally conductive film, such as figure 1 shown;

[0058] (2) The adhesive layer 12 is laminated on the thermally conductive film 10 formed in the step (1), and then the thermally conductive film 10 formed in the step (1) is further laminated on the adhesive layer. This step allows the adhesive 12a to enter the plurality of holes 11 . Repeat this layer-by-layer alternate stacking process to form a stack 2, such as figure 2 shown;

[0059] (3) Pressing and molding the stacked body 2 obtained in step (2), and performing vulcanization treatment;

[0060] (4) the molded body obtained in step (3) along the direction perpendicular to the plane of the heat-conducting film (such as figure 2 The direction indicated by the arrow in the middle) slic...

Embodiment 1

[0074] In this embodiment, the preparation process of the vertical high thermal conductivity gasket reinforced by graphene thermal film includes the following steps:

[0075] 1) The graphene heat conduction film with a thickness of 4 μm is perforated by laser technology, running through the upper and lower surfaces, the hole size is 200 μm, and the hole spacing is 200 μm;

[0076] 2) uniformly mixing the silica gel and heat-conducting alumina powder, and performing defoaming treatment to obtain a mixed silica gel, wherein the alumina content is 70%;

[0077] 3) Apply the mixed silicone gel obtained in step 2) evenly on the surface of the graphene heat conduction film perforated in step 1) by scraping, and stack the graphene heat conduction film staggered to form a stack ;

[0078] 4) Place the stacked body in step 3) in a mold, and perform hot-press molding at 60° C. after vacuum defoaming;

[0079] 5) directly carry out vulcanization treatment on the basis of step 4), and t...

Embodiment 2

[0084] In this embodiment, the preparation process of the vertical high thermal conductivity gasket reinforced by graphene thermal film includes the following steps:

[0085] 1) The graphene heat-conducting film with a thickness of 60 μm is drilled by laser technology, running through the upper and lower surfaces, the hole size is 0.5 μm, and the hole spacing is 5 μm;

[0086] 2) Uniformly mixing silica gel and heat-conducting aluminum nitride, and performing defoaming treatment to obtain a mixed silica gel, wherein the content of aluminum nitride is 60%;

[0087] 3) Evenly apply the mixed silicone gel obtained in step 2) to the surface of the graphene heat-conducting film perforated in step 1) by scraping, and stack the graphene heat-conducting film staggered to form a stack;

[0088] 4) Place the stacked body in step 3) in a mold, and perform hot-press molding at 80° C. after vacuum defoaming;

[0089] 5) directly carry out vulcanization treatment on the basis of step 4), a...

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Abstract

The invention provides a heat-conducting gasket, which comprises a heat-conducting film and a binder layer, and optionally comprises other heat-conducting fillers, wherein the heat-conducting is provided with a plurality of holes penetrating through the upper surface and the lower surface of the heat-conducting film, and the holes are filled with a binding agent. Therefore, the binding agents in different layers can be connected through the plurality of holes to form a continuous structure, the heat-conducting film is wrapped on the microscale, the binding agent and the heat-conducting film can be strongly combined together without a surface coating, and meanwhile, the problem of layering of the heat-conducting film is avoided.

Description

technical field [0001] The invention relates to a heat conduction gasket and a preparation method thereof, and more specifically relates to a longitudinal high heat conduction gasket reinforced by a heat conduction film, which belongs to the technical field of heat conduction and heat dissipation. Background technique [0002] With the rapid development of mobile networks, more and more electronic devices are connected to the mobile network, and a large number of new services and applications have been spawned. Especially with the advent of the 5G era, the functions of mobile network equipment products have become more powerful, and the power consumption has also increased simultaneously. At the same time, the size of the design space has become smaller and smaller, and the heat energy generated by electronic components during use is increasing. If the heat energy cannot be dissipated from the inside in time, it will slow down the operation speed of electronic components and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/24B32B7/12B32B9/00B32B33/00B32B38/00B32B37/12B32B38/04B32B37/10C09J11/04H05K7/20
CPCB32B3/266B32B7/12B32B9/007B32B33/00B32B38/0008B32B38/00B32B37/12B32B38/04B32B37/10B32B38/0004C09J11/04H05K7/2039B32B2038/0092B32B2307/51B32B2307/302B32B2038/047B32B2038/0076
Inventor 葛翔李峰周步存
Owner CHANGZHOU FUXI TECH CO LTD
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