Polishing slurry composition for sti process

A technology of composition and slurry, which is applied in the direction of polishing composition containing abrasives, other chemical processes, water-based dispersants, etc., can solve problems such as scratches and large depression of insulating film, so as to prevent over-polishing and excellent flatness The effect of high degree and high removal speed
CN113195658AInactive Publication Date: 2021-07-30K C TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
K C TECH
Publication Date
2021-07-30
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The present invention relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.
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Description

technical field

[0001] The present invention relates to a polishing slurry composition for an STI process capable of reducing dishing while having a high polishing rate. Background technique

[0002] As semiconductor elements become more diverse and highly integrated, a technology capable of forming fine patterns is used, which makes the surface structure of semiconductor elements more and more complicated, and the step difference of the surface film becomes larger and larger. In the process of manufacturing semiconductor elements, chemical mechanical polishing (CMP, chemical mechanical polishing) planarization technology is used to remove the step difference formed on a specific film of a substrate. Insulation for shallow trench isolation (STI) that is used as a process for removing excessively formed insulating films for interlayer insulation and insulation between interlayer insulating films (interlayer dielectric, ILD) and chips (chips). It is used in the planarization ...

Claims

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