30results about How to "Avoid over polishing" patented technology

The invention discloses a polishing device for surfaces of building boards. The polishing device comprises a support, a polishing device body, a wire, sliding rods, a fulcrum bar, a control cabinet, a collection box, a fixing groove, a base, suction holes, clamping plates, a bearing frame, extending and retracting rods, a limiting clamping plate, a polishing disk, lantern rings, a rotating rod, an inner rod and a spring. The polishing device has the beneficial effects that the two sliding rods are arranged in the support, the polishing device body is arranged on the sliding rods through the lantern rings, the polishing device body can slide on the sliding rods to adjust the polishing position in the polishing process, and therefore uniform polishing is achieved. The suction holes are formed in the inner wall of one side of the fixing groove and communicate with a draught fan in the collection box, chippings produced in the polishing process can be absorbed into the collection box through the suction holes, and the situation that the chippings produced in the polishing process affect the polishing effect is avoided. By arranging the clamping plates which can extend and retract are arranged on the inner walls of the two sides of the fixing groove, the building boards are fixed through the extending and retracting clamping plates, and therefore it is ensured that the boards cannot shake in polishing.

The invention relates to the technical field of polishing, and discloses an electrochemical polishing device and polishing method for a vascular stent. The polishing device comprises a lifting assembly, an anode assembly, an adjusting assembly and a cathode assembly; the lifting assembly comprises a lifting frame and a first driving mechanism; the anode assembly comprises an anode, an elastic piece, a vibration source and a metal wire which are connected in sequence; the metal wire is used for mounting the vascular stent and has a contracted state and an expanded state, wherein in the contacted state, the metal wire is movably connected with the vascular stent, and in the expanded state, the metal can be fixedly connected with the vascular stent; the adjusting assembly comprises a first supporting frame and a second driving mechanism, and the first supporting frame is connected with the metal wire and provided with a vertical position where the metal wire can be in the contracted stateand a horizontal position where the metal wire can be in the expanded state; and the cathode assembly is arranged below the anode assembly and comprises a polishing barrel containing a polishing solution and a cathode arranged in the polishing barrel. The electrochemical polishing device is simple and compact in structure, convenient to operate, uniform in polishing, good in polishing effect andhigh in efficiency.

The invention belongs to the technical field of graphite product machining equipment, and particularly discloses high-precision polishing equipment for graphite slices. The high-precision polishing equipment for the graphite slices comprises a rack, a workbench and a grinding assembly. Small holes are formed in the surface of the workbench for vacuumizing to adsorb and fix the graphite slices, double sliding rails and the grinding assembly are arranged on the rack for adjustment of polishing positions, and the relatively high polishing precision is obtained preliminarily; annular channels communicating with the small holes are formed in the peripheries of the small holes to enhance the vacuum adsorption effect, with the arrangement of a concave area of the workbench combined, it is guaranteed that the graphite slices cannot deviate in position in the polishing process, and the polishing precision is improved; and through the three-layer structural design of a metal layer, a rubber layer and a polishing layer of a polishing disc, the stability of the grinding assembly is improved, and the polishing precision is further improved; in addition, the high-precision polishing equipment for the graphite slices also has the characteristics that the operation is easy, the safety is high, the polishing layer can be easily replaced, and the polishing efficiency is high.

A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency

The invention belongs to the technical field of glass processing, and particularly relates to a glass product polishing device which comprises a workbench, a rotary clamping mechanism, a polishing mechanism and a lifting mechanism. The rotary clamping mechanism comprises a sleeve, a power part and an L-shaped clamping plate, a piston and a reset piece are slidably connected in the sleeve, and a piston rod is arranged on the piston; the polishing mechanism comprises a mounting block, a cavity is formed in the mounting block, two polishing blocks are slidably connected to the side wall of the mounting block, and an elastic part is arranged in the cavity; an adjusting cylinder is fixed on the mounting block, and an adjusting plate is slidably connected in the adjusting cylinder; a one-way inflow valve and a one-way outflow valve are arranged on the side wall of the mounting block; the sleeve, the sliding groove, the adjusting cylinder and the cavity are all filled with transmission media; a limiting block is arranged on the inner wall of the adjusting cylinder; and the lifting mechanism is used for controlling lifting of the workbench. By the adoption of the scheme, the bottle opening of a glass product can be specifically and rapidly polished, meanwhile, the polishing degree can be effectively controlled, and excessive polishing is avoided.

The invention discloses a polishing paste for modifying and processing a plastic product, and relates to the technical field of processing a plastic product. The polishing paste is prepared from the following raw materials, by weight: 80-90 parts of modified bentonite, 30-35 parts of soap powder, 25-30 parts of zeolite powder, 15-20 parts of fly ash, 15-20 parts of rape seed cake powder, 13-18 parts of tea seed powder, 12-16 parts of tung oil, 10-15 parts of modified microcrystalline wax, 8-12 parts of active carbon, 8-12 parts of silica powder, 6-10 parts of vaseline, 5-8 parts of tallow, 50-60 parts of ethanol, and 300-350 parts of water. According to the invention, the polishing paste for modifying and processing a plastic product is prepared by taking modified bentonite as a main raw material, and can be directly coat the surface of the plastic product. The polishing effect can be effectively improved; the dimension accuracy of the plastic product can be furthest protected; and over polishing is prevented.

The invention provides a polishing head and a polishing device. The polishing head is used for keeping a wafer on a polishing platform. The polishing head comprises a shell and a limiting ring connected to the shell. The limiting ring surrounds the wafer to limit the wafer. The polishing head further comprises a bracket located in the limiting ring. A back film leaning against the surface of the wafer is arranged on the bracket. The bracket is slidably assembled on the shell along a first direction. The polishing head further comprises a driving device which drives the bracket to slide relative to the shell along the first direction. By way of slidably assembling the bracket on the shell along a direction parallel to the axis of the limiting ring and arranging the driving device to drive the bracket to slide along the axis direction of the limiting ring relative to the shell, the bracket can be driven by the driving device to move along a direction far away from the wafer when the limiting ring is relatively worn severely and the separation distance between the bracket and the surface of the wafer is kept in a reasonable range, so that the separation distance between the wafer andthe bracket is not reduced as a result of wear of the limiting ring, and therefore, the edge of the wafer is prevented from being polished excessively.

The invention discloses a 3D printing object surface polishing and strengthening device. The device comprises an outer shell, a top cover arranged at the top of the outer shell, a bottom cover arranged at the bottom of the outer shell, a separation plate arranged in the outer shell, a polishing liquid holding tank formed above the separation plate, a liner arranged above the polishing liquid holding tank, a tray arranged in the liner, an electric heating plate arranged under the separation plate, and an electronic relay arranged on the bottom cover. The 3D printing object surface polishing andstrengthening device can hold polished objects made of multiple materials and multiple types of polishing liquid, is uniform in polishing, high in polishing efficiency and excellent in polishing effect, improves the rupture strength and the toughness of the polished objects, recycles the polishing liquid, is safe in operation, protects the environment, and saves the cost; and the polishing devicecan be zoomed according to equal proportion, and the capacity can be increased or reduced according to special polishing demands, so that the size application range of the polished objects is more free.

The invention provides a polishing device and a polishing assembly. The polishing device is used for polishing a wafer. The polishing device comprises a rotary plate capable of rotating, a polishing pad with a polishing surface, and a sprayer on the upper side of the polishing pad, wherein the polishing pad is arranged on the rotary plate, and the sprayer is used for spraying a polishing solutionto the polishing surface. The polishing surface is divided into a plurality of polishing areas, and solution discharging holes are formed in the polishing areas respectively and used for discharging the polishing solution in the polishing areas. The polishing device further comprises control valves for controlling whether the polishing solution is discharged from the solution discharging holes ornot respectively. By dividing the polishing surface into the polishing areas, forming the solution discharging holes in the polishing areas respectively and arranging the control valves for controlling whether the polishing solution is discharged from the solution discharging holes or not, the amount of the polishing solution at different positions of the wafer is easily controlled. In use, for the high-polishing area on the wafer, a certain amount of the polishing solution on the corresponding polishing area can be correspondingly discharged, and accordingly, the wafer is prevented from beingover polished to control the uniformity of film-forming patterns on the wafer.

The invention provides a polishing method of a semiconductor wafer. The polishing method of the semiconductor wafer sequentially comprises the following steps: S1, primarily polishing the front side and the reverse side of the semiconductor wafer simultaneously; S2, forming an annular oxidation layer on each of the front side and the reverse side of the semiconductor wafer, wherein the annular oxidation layers cover the outer circumferential areas, near the edge, of the front side and the reverse side of the semiconductor wafer; S3, performing mirror polishing on the edge of the semiconductorwafer and removing the annular oxidation layers; and S4, performing mirror polishing on the front side or the front side and the reverse side of the semiconductor wafer. By the polishing method of thesemiconductor wafer, excessive polishing of the area, near the edge, of the surface of the semiconductor wafer in the edge polishing step can be avoided; furthermore, after the edge of the semiconductor wafer is polished, the annular oxidation layers are completely removed and influence on the subsequent polishing step is avoided, so the method is simple, economic and practical.

The invention discloses an electrochemical layer-by-layer polishing device for an additive manufacturing metal tubular part, and relates to the technical field of precision surface treatment. The electrochemical layer-by-layer polishing device mainly comprises a control driving part, a power supply, an electrode and a working solution; during working, an additive manufacturing metal tubular part to be polished is placed at a set position, the electrode extends to the inner part of the additive manufacturing metal tubular part; the anode of the power supply is connected with the additive manufacturing metal tubular part, the cathode of the power supply is connected with the electrode; and the control driving part is connected with the electrode and/or the additive manufacturing metal tubular part, the control driving part is used for controlling the fact that relative movement of the electrode and the additive manufacturing metal tubular part is carried out so that the electrode, the additive manufacturing metal tubular part and the working solution form an electric loop, and then anodic dissolution occurs between the inner surface of the additive manufacturing metal tubular part and the electrode. According to the electrochemical layer-by-layer polishing device for the additive manufacturing metal tubular part, the inner hole wall surface of the additive manufacturing part canbe effectively smoothened, and adhesive particles are removed, so that the inner hole wall surface of the additive manufacturing part meets the machining standard.

The invention relates to the technical field of optics, and discloses a polishing self-adaptive polishing pressure self-cleaning intelligent device for an optical lens. The intelligent device comprises the lens, a clamping plate is movably connected to the surface of the lens, a threaded rod is movably connected to the inner wall of a sliding groove, a piezoresistor is movably connected to the side surface of an inclined plate, a gear is movably connected to the surface of the threaded rod, the surface of the gear is movably connected with an air bin, the surface of the gear is movably connected with a piston rod, the other end of the piston rod is movably connected with a piston plate, the surface of the lens is movably connected with a polishing disc, and the bottom end of the rotating rod is fixedly connected with an electromagnet. In the lens polishing process, the thickness is reduced, the magnetism of the electromagnet is increased, the pressure of the polishing disc and the lens is gradually reduced, excessive polishing is prevented, the threaded rod moves downwards to drive the gear to rotate, scraps diffused during lens polishing are sucked into the air bin, and the piston rod and the piston plate reciprocate in the horizontal direction, so that the chippings in the piston plate are compacted.

The invention relates to the technical field of optical lens processing equipment, and discloses a polishing device with an alarm function, the polishing device comprises a carrier plate, a machine body is fixedly mounted on the right side of the top of the carrier plate, a motor is fixedly mounted on the left side of the top of the machine body, and a rotating rod is in transmission connection with the bottom of a transmission shaft of the motor and extends into a sleeve. A bolt penetrates through the middle of the front wall of the sleeve, the rear end of the bolt is rotationally connected with a screw hole preset in the rotating rod through threads, a polishing rotating disc is fixedly installed at the bottom of the sleeve, and a lens body is placed on the right lower side of the polishing rotating disc. By arranging a spring and a limiting block, when the polishing rotary disc is used for polishing and thinning the lower side lens, acting force can be applied to the supporting plate through the spring, the lens moves upwards in a self-adaptive mode under the acting force of the spring, when the limiting block abuts against the carrying plate, a workpiece stops moving upwards, excessive polishing of the workpiece is avoided, meanwhile the carrying plate can extrude the touch switch and the alarm to be powered on and run; the device is used for reminding workers to replace workpieces in time.

The invention discloses a polishing device for glass decoration product production. An operation table is included, and a machine cabinet is fixedly installed on the lower surface of the operation table; a cabinet door is movably installed on the front wall of the machine cabinet; the front side position of the bottom of the inner wall of the machine cabinet is provided with a motor; a first fixedcolumn and a second fixed column are perpendicularly and fixedly installed at the rear side position of the upper surface, close to a polishing disk, of the operation table; connection plates are arranged at the outer wall positions of the sides, away from each other, of the first fixed column and the second fixed column; the first fixed column is fixedly provided with a cylinder through the corresponding connection plate; the middle positions of the outer walls of the sides, close to each other, of the two cylinders are each movably connected with a piston rod; and the ends, close to each other, of the two piston rods are each in threaded connection with a screw sleeve. In the polishing device for glass decoration product production, the polishing device can be used for limiting the depth of polishing, excessive polishing is avoided, meanwhile, clamping plate replacing is convenient, and the machining requirement of glass decoration products in different types can be met.