Preparation method of polyimide-based graphite film
A polyimide-based and polyimide-film technology, which is applied in the field of polyimide-based graphite film preparation, can solve the problems of graphite film structure and performance impact, and improve birefringence and thermal conductivity. and electrical conductivity, high degree of imidization, excellent thermal conductivity and electrical conductivity
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Embodiment 1
[0023] Preparation of polyimide film:
[0024] (1) Under the protection of nitrogen, add pyromellitic dianhydride into the N,N-dimethylformamide solution containing 1,5-naphthalene diamine and p-phenylenediamine, and stir at 40°C for 4 hours to obtain poly Amic acid solution; wherein, the molar ratio of pyromellitic dianhydride to diamine (1,5-naphthalene diamine and p-phenylene diamine) is 1:1; among the diamines, 1,5-naphthalene diamine accounts for the diamine 10% of the total molar weight;
[0025] (2) casting the polyamic acid solution on a treated glass plate to form a film, partially removing the solvent under hot air at 140°C, and cooling to room temperature to obtain a polyamic acid gel film;
[0026] (3) The polyamic acid gel film is stretched longitudinally and transversely, and then placed in a high-temperature blast drying oven to raise the temperature at a rate of 8°C / min, and keep warm at 120°C, 240°C, and 310°C respectively. The imidization treatment was comp...
Embodiment 2
[0030] Preparation of polyimide film:
[0031] (1) Under the protection of nitrogen, add 3,3',4,4'-biphenyltetracarboxylic dianhydride to [1,1'-binaphthyl]-2,2'-diamine and 4,4'- In the N,N-dimethylacetamide solution of diaminodiphenylmethane, stir and react at 45°C for 4h to obtain a polyamic acid solution; among them, 3,3',4,4'-biphenyltetracarboxylic dianhydride and diphenyltetracarboxylic dianhydride Amine ([1,1'-binaphthyl]-2,2'-diamine and 4,4'-diaminodiphenylmethane) molar ratio is 1.005:1; among diamines, [1,1'-binaphthyl ]-2,2'-diamine accounts for 5% of the total molar weight of diamine;
[0032] (2) casting the polyamic acid solution on a treated glass plate to form a film, partially removing the solvent under hot air at 150°C, and cooling to room temperature to obtain a polyamic acid gel film;
[0033] (3) The polyamic acid gel film is stretched longitudinally and transversely, and then placed in a high-temperature blast drying oven to raise the temperature at a ...
Embodiment 3
[0037] Preparation of polyimide film:
[0038] (1) Under the protection of nitrogen, add pyromellitic dianhydride to the N-methyl-2-pyrrolidone solution containing 1,5-naphthalene diamine and 1,4-bis(4-aminophenoxy)benzene , stirred and reacted at 50°C for 3.5h to obtain a polyamic acid solution; wherein, pyromellitic dianhydride and diamine (1,5-naphthalene diamine and 1,4-bis(4-aminophenoxy)benzene) moles The ratio is 1.05:1; among diamines, 1,5-naphthalene diamine accounts for 20% of the total molar weight of diamines;
[0039] (2) casting the polyamic acid solution on a treated glass plate to form a film, partially removing the solvent under hot air at 160°C, and cooling to room temperature to obtain a polyamic acid gel film;
[0040] (3) The polyamic acid gel film is stretched longitudinally and transversely, and then placed in a high-temperature blast drying oven to raise the temperature at a rate of 8°C / min, and keep warm at 100°C, 220°C, and 300°C respectively The im...
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