Heat dissipation device based on graphene heating chip

A heating chip and heat dissipation device technology, which is applied in the direction of cooling/ventilation/heating transformation, modification through conduction heat transfer, etc., can solve the problems of poor heat dissipation effect and easy deformation of the heating chip, and achieve improved heat conduction effect, convenient operation, and difficult deformation effect

Pending Publication Date: 2021-08-06
济南市白象科技发展有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The graphene heating chip is energized to convert electrical energy into heat energy, and can meet the requirements of providing high heat with low power. However, the packaging of the heating chip in the existing heat dissipation device has the problems of easy deformation and poor heat dissipation, so that the graphene heating chip cannot Widely used in automotive engine cooling systems and household electric heaters

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation device based on graphene heating chip
  • Heat dissipation device based on graphene heating chip
  • Heat dissipation device based on graphene heating chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to clearly illustrate the technical features of the solution, the solution will be described below through specific implementation modes.

[0023] Such as figure 1 Shown is a heat dissipation device based on a graphene heating chip, comprising a support, several layers of radiators 1 arranged in sequence from top to bottom, and a graphene heater 2 arranged between adjacent two layers of radiators, radiator and The graphene heating body is fixedly connected with the support to form a whole radiator. The heat sink in this embodiment is a corrugated heat dissipation aluminum strip to ensure smooth heat conduction. In practical applications, different numbers of heat dissipation aluminum strips are selected to form heat sinks with different powers as required.

[0024] The graphene heating body includes a heat conduction shell 3 which is in contact with the radiator, and a graphene chip 7 fixed in the heat conduction shell, and the contacts of the graphene chip ar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to a heat dissipation device based on a graphene heating chip. The device comprises a plurality of layers of heat dissipation bodies and graphene heating bodies arranged between every two adjacent layers of heat dissipation bodies, each graphene heating body comprises a heat conduction shell in contact connection with the heat dissipation bodies and a graphene chip fixedly arranged in the heat conduction shell, a contact of each graphene chip is connected with a wire. Through staggered arrangement of the heat dissipation bodies and the graphene heating bodies layer by layer, the heat dissipation area is increased, and the heat conduction effect is improved; heat-conducting sealing layers are arranged on the two sides of each graphene chip to form a first protection layer, and a heat-conducting insulating plate is arranged to form a second protection layer, so that the sealing effect is improved; and the dual safety protection packaging mode of the ceramic adhesive and the high-temperature insulating paint is anti-creeping and safe to use, so that the heat conduction of the two sides of each graphene chip is more uniform, a heating adhesive sheet is not easy to burn out, the effective safety protection of each chip is ensured, and the insulating property is improved.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to the field of encapsulation and application of graphene heating chips, and specifically refers to a heat dissipation device based on graphene heating chips. Background technique [0002] The radiator is an important part in the fields of automobile engine cooling system and household electric heater, etc. Its function is to dissipate the absorbed heat into the air to form heat exchange. Current car radiators and household electric heaters have high power and consume a lot of electricity. Therefore, a radiator with low power and high energy is required to be widely used. The graphene heating chip is energized to convert electrical energy into heat energy, and can meet the requirements of providing high heat with low power. However, the packaging of the heating chip in the existing heat dissipation device has the problems of easy deformation and poor heat dissipation, so that the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 黄泽军王桂玲燕鹏飞谷新涛李文刚绳本禄张俊苹何爱峰
Owner 济南市白象科技发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap