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Processing production equipment and processing method of packaging substrate

A technology for encapsulating substrates and production equipment, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve problems such as batch processing of unpackaged substrates, hazards of pickling liquid workers, and inability to meet the use requirements, etc., to achieve the guarantee Material efficiency, avoid harm, ensure the effect of usability

Active Publication Date: 2021-08-13
深圳和美精艺半导体科技股份有限公司
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AI Technical Summary

Problems solved by technology

[0003] At present, the processing of packaging substrates requires repeated operations such as pickling, rinsing with clean water, and drying. Conventional packaging substrate processing equipment has a low degree of automation, and staff are required to manually pickle and load the packaging substrates. Batch processing and pickling liquid is easy to cause harm to the staff, which can no longer meet the needs of use

Method used

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  • Processing production equipment and processing method of packaging substrate
  • Processing production equipment and processing method of packaging substrate
  • Processing production equipment and processing method of packaging substrate

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] see Figure 1-12 , a processing and production equipment and processing method for packaging substrates, including a substrate body and a body 1 for automatically loading, pickling, washing with clean water and drying operations on the substrate body, a conveying mechanism 2, a lifting mechanism 3, an upper Material mechanism 4, drainage mechanism 5, wiping mechanism 6, pipeline mechanism 7 and drying mechanism 8, the substrate body includes a ceramic s...

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Abstract

The invention discloses processing production equipment and a processing method of a packaging substrate, and relates to the technical field of packaging substrate processing. The equipment comprises a base plate body, a machine body, a conveying mechanism, a lifting mechanism, a feeding mechanism, a drainage mechanism, a wiping mechanism, a pipeline mechanism and a drying mechanism, wherein the machine body is used for automatically carrying out feeding, acid pickling, clean water washing and drying operation on the base plate body; the base plate body comprises a ceramic substrate; and an inner layer thick copper foil and an outer layer thin copper foil are sequentially arranged on the two sides of the ceramic substrate. Through the arrangement of the machine body, the conveying mechanism, the lifting mechanism and the feeding mechanism, the base plate body to be subjected to acid pickling is automatically fed through conveying rollers, the base plate body is transferred among the acid pickling, wiping and drying procedures in cooperation with a feeding frame capable of moving left and right, and compared with a conventional manual feeding mode, the substrate body feeding efficiency is guaranteed, and meanwhile, the harm of the pickling solution to workers is avoided, and the usability of the device is guaranteed.

Description

technical field [0001] The invention relates to the technical field of packaging substrate processing, in particular to a processing production equipment and a processing method of a packaging substrate. Background technique [0002] The packaging substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. Packaging substrates should be an interdisciplinary technology, which involves knowledge of electronics, physics, and chemical engineering. [0003] At present, the processing of packaging substrates requires repeated operations such as pickling, rinsing with clean water, and drying. Conventional packaging substrate processing equipment has a low degree of automation, and staff are required to manually pickle and load the packaging substrates. Ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/67
CPCH01L21/48H01L21/67034H01L21/67051H01L21/67057
Inventor 何福权
Owner 深圳和美精艺半导体科技股份有限公司
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