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Lithography control method, device and storage medium

A control method and lithography technology, which can be used in photolithography process exposure devices, microlithography exposure equipment, optics, etc., and can solve the problems of target period dark lines, uneven areas, and the inability to eliminate positioning accuracy errors of splicing platforms. Solve periodic dark lines, improve uniformity, and achieve the effect of continuous operation

Active Publication Date: 2022-07-26
SVG TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a photolithography control method, device and storage medium, which can solve the problem that the positioning accuracy error of the splicing platform itself cannot be eliminated, resulting in periodic dark lines and uneven regions in the target after photolithography

Method used

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  • Lithography control method, device and storage medium
  • Lithography control method, device and storage medium
  • Lithography control method, device and storage medium

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Embodiment Construction

[0057] The specific implementations of the present application will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are used to illustrate the present application, but are not intended to limit the scope of the present application.

[0058] figure 1 is a schematic structural diagram of a laser direct writing system provided by an embodiment of the present application, such as figure 1 As shown, the system at least includes: a system control component 110 , an image acquisition component 120 , a lithography component 130 and a platform component 140 which are respectively connected in communication with the system control component 110 .

[0059] The stage assembly 140 includes a lithography stage 141 for placing the product to be lithography and a stage control assembly 142 for controlling the operation of the lithography stage 141 .

[0060] The image acquisition component 120 is used for acquiring ima...

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Abstract

The invention relates to a lithography control method, a device and a storage medium, belonging to the technical field of micro-nano processing. The method includes: obtaining a lithography task; and layering all lithography dots in the lithography task to obtain n-layer lithography Dot: Divide each layer of lithography dots into regions to obtain lithography dot data in the region; perform lithography according to the lithography dot data in each region of each layer until the lithography task is completed; judge whether there is a next light If there is none, it will end; if there is, perform the lithography task again; it can solve the problem that the positioning accuracy error of the splicing platform itself cannot be eliminated, resulting in the phenomenon of periodic dark lines and uneven areas on the target after lithography; There is an intersection between the layer areas to which the lithography dots of different layers belong. Therefore, for the part that needs to be spliced ​​and lithography, the galvanometer scanning can be performed again through the intersection of different layers to realize the transition of the spliced ​​part and reduce the error caused by the positioning accuracy of the platform itself. .

Description

technical field [0001] The present application relates to a lithography control method, device and storage medium, and belongs to the technical field of micro-nano processing. Background technique [0002] Laser direct writing technology is a lithography technology that does not require a lithography mask. The surface of the sample is directly irradiated by a laser with variable intensity, and the sample is regularly moved or the position of laser irradiation is changed under the control of the computer to form nanostructures on the surface of the sample; it is widely used in the processing of two-dimensional optical components, micro-electromechanical systems, high-precision printing Circuit boards, semiconductor masks, light guide plate mold cores, etc. [0003] Taking the application of laser direct writing technology to the mold core of lithography light guide plate as an example, the typical implementation method is to use pulsed laser combined with galvanometer to dir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70508G03F7/704G03F7/2053G03F7/20B23K26/362G02B6/00G02F1/1335
Inventor 朱鹏飞张恒浦东林张瑾吕帅陈林森
Owner SVG TECH GRP CO LTD