A kind of alumina passivation film of perc battery and its deposition method and application
A deposition method and aluminum oxide technology, which can be used in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as potential safety hazards and poor uniformity, and achieve the effects of improving efficiency, improving film thickness uniformity, and reducing darkening
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Embodiment 1
[0035] This embodiment provides a method for depositing an aluminum oxide passivation film on the backside of a silicon wafer during the process of preparing a crystalline silicon solar cell, and the deposition method is as follows:
[0036] (1) Vacuuming, heating the furnace tube to 350 ° C, then pre-injecting nitrous oxide and trimethyl aluminum synchronously, the constant pressure is 1300mt, and the sum of the time of pre-injection and constant pressure is 20s, wherein, the nitrous oxide The pre-injection flow is 5500sccm, and the pre-injection flow of trimethylaluminum is 66g / h;
[0037] (2) Turn on the microwave, continue to feed nitrous oxide and trimethylaluminum, and carry out deposition to obtain a silicon wafer coated with an aluminum oxide passivation film.
Embodiment 2
[0039] This embodiment provides a method for depositing an aluminum oxide passivation film on the backside of a silicon wafer during the process of preparing a crystalline silicon solar cell, and the deposition method is as follows:
[0040] (1) Vacuuming, heating the furnace tube to 280 ° C, then pre-injecting nitrous oxide and trimethyl aluminum synchronously, the constant pressure is 800mt, the sum of the time of pre-injection and constant pressure is 50s, wherein, the nitrous oxide The pre-injection flow is 4000sccm, and the pre-injection flow of trimethylaluminum is 30g / h;
[0041](2) Turn on the microwave, continue to feed nitrous oxide and trimethylaluminum, and carry out deposition to obtain a silicon wafer coated with an aluminum oxide passivation film.
Embodiment 3
[0043] This embodiment provides a method for depositing an aluminum oxide passivation film on the backside of a silicon wafer during the process of preparing a crystalline silicon solar cell, and the deposition method is as follows:
[0044] (1) Turn off the radio frequency power supply, evacuate, heat the furnace tube to 340 ° C, and then pre-inject nitrous oxide and trimethyl aluminum simultaneously, the constant pressure is 1500mt, and the total time of pre-injection and constant pressure is 120s, among which , the pre-injection flow of nitrous oxide is 7000sccm, and the pre-injection flow of trimethylaluminum is 100g / h;
[0045] (2) Turn on the microwave, continue to feed nitrous oxide and trimethylaluminum, and carry out deposition to obtain a silicon wafer coated with an aluminum oxide passivation film.
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