Wafer feeding device and wafer film pasting device

Abstract

The invention discloses a wafer feeding device and a wafer film pasting device. The wafer feeding device comprises a grabbing mechanism, a switching mechanism and a bearing mechanism, wherein the grabbing mechanism comprises a first vertical air cylinder, a pneumatic suction cup arranged at the movable end of the first vertical air cylinder and a zigzag-shaped frame, the fixed end of the first vertical air cylinder is connected to one end of the zigzag-shaped frame, the other end of the zigzag-shaped frame is connected with a rotating shaft, the rotating shaft is connected with an output shaft of a rotating motor, the rotating shaft is rotationally matched with the pair of supporting plates, the supporting plates and the rotating motor are arranged on a sliding base, and the sliding base is arranged on a first linear mechanism; the switching mechanism comprises a second linear mechanism arranged above the grabbing mechanism, a distance adjusting mechanism arranged at the movable end of the second linear mechanism, a pair of second vertical air cylinders connected with the distance adjusting mechanism, and a switching frame connected to the movable ends of the second vertical air cylinders; and the bearing mechanism comprises a bearing table arranged on the base through a supporting column and is used for bearing a wafer. The wafer film pasting device comprises the wafer feeding device, a film pasting assembly and the like. Automatic wafer feeding and automatic film pasting are achieved, the labor intensity is reduced, automatic operation is achieved, and the efficiency is high.

Description

Technical field [0001] The present invention relates to integrated circuit packaging technology, particularly relates to a feeding apparatus and wafer A wafer film sticking apparatus. Background technique [0002] In the integrated circuit package, it is necessary pick up the chip from the wafer to the wafer for the core. In general, the need for wafer pretreatment plant, such as film, thinning, dicing, and then fed into the die step. When the wafer factory, one side typically comes with a protective film, foil film is made on the other side, on the one hand for protecting the wafers, on the other hand to facilitate the protective film removed, the chip still attached together can be , facilitate thinning, thinning and after dicing and the like. Currently, during film, since the protective film is a wafer having one surface contacts the load platform, to facilitate the film for the other surface, and the wafer to be carried to the feeding station by gripping means, not convenient...

AI Technical Summary

Problems solved by technology

At present, when attaching the film, since one side of the wafer has a protective film in contact with the carrier, it is convenient to attach the film to the other side, but it is not convenient to use the grabbing mechanism to load the wafer to the carrier It directly acts on the side that does not have a protective film. Therefore, most of the wafers are picked up manually in the factory area, and then loaded to the carrier of the film laminating machine, and then sent to the laminating machine on the carrier for film lamination. Then manually rotate the cutter to cut off the film in the circular area, and use the manual back and forth to push the cutter to cut the film. This method is time-consuming and labor-intensive, and it needs to be improved.

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