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Preparation method of graphene reinforced copper-based composite material with high heat-conducting property

A technology of copper-based composite materials and graphene, which is applied in the field of preparation of graphene-reinforced copper-based composite materials, can solve problems such as the reduction of thermal conductivity of composite materials, and achieve composite materials with excellent performance, fully dispersed and unfolded, and high thermal conductivity. Effect

Pending Publication Date: 2021-09-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims to solve the problem that graphene-reinforced copper-based composite materials are prone to generate graphene defects in the process of mixing and dispersing, which reduces the thermal conductivity of composite materials, and provides a graphene-reinforced copper-based composite material with high thermal conductivity. preparation method

Method used

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  • Preparation method of graphene reinforced copper-based composite material with high heat-conducting property
  • Preparation method of graphene reinforced copper-based composite material with high heat-conducting property
  • Preparation method of graphene reinforced copper-based composite material with high heat-conducting property

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specific Embodiment approach 1

[0016] Specific embodiment one: the preparation method of a kind of high thermal conductivity graphene reinforced copper-based composite material of this embodiment is to carry out according to the following steps:

[0017] 1. Weighing raw materials: weighing 0.1% to 5% multilayer graphene nanosheets and 95% to 99.9% copper metal powder as raw materials according to mass fraction; the particle size of the copper metal powder is 1 to 15 μm;

[0018] 2. Ball milling and mixing: put raw materials and grinding aid carbon sources into a ball milling tank, the ball-to-material ratio in the ball milling tank is (2-20): 1, and ball milling at a speed of 100-400rpm for 2-15 hours to obtain a mixed material; The mass ratio of the raw material to the grinding aid carbon source is 1:(0.05~0.5); the grinding aid carbon source is polyethylene glycol, sucrose or glucose;

[0019] 3. Preparation of composite materials by pre-pressing and plasma sintering: put the mixed materials into graphite...

specific Embodiment approach 2

[0029] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in step 1, 0.3% multilayer graphene nanosheets and 99.7% copper metal powder are weighed as raw materials by mass fraction. Others are the same as the first embodiment.

specific Embodiment approach 3

[0030] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that in step 1, 1% multilayer graphene nanosheets and 99% copper metal powder are weighed as raw materials by mass fraction. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a preparation method of a graphene reinforced copper-based composite material with high heat-conducting property, in particular to a preparation method of a graphene reinforced copper-based composite material with high heat-conducting property. The invention aims to solve the problem that the heat-conducting property of the composite material is reduced due to the fact that graphene defects are easily generated in the mixing and dispersing process of the graphene reinforced copper-based composite material at present. The method comprises the following steps: 1, weighing 0.1%-5% of multi-layer graphene nanosheets and 95%-99.9% of copper metal powder with the particle size of 1 to 15 microns; 2, mixing and ball-milling copper metal powder, graphene, an introduced carbon source and the like; 3, decomposing and repairing graphene by using a plasma sintering carbon source to prepare a graphene reinforced copper-based composite material; and 4, carrying out plastic deformation on the prepared graphene copper-based composite material under the conditions of certain deformation temperature, deformation rate and deformation amount. The method is used in the field of electronic packaging with high heat dissipation requirements.

Description

technical field [0001] The invention relates to a method for preparing a graphene-reinforced copper-based composite material with high thermal conductivity. Background technique [0002] Copper is a purple-red metal with a low melting point of only 1083.4°C. It also has a high thermal conductivity of 401W / mK and a low resistivity of 1.75×10 among metals. -8 Ωm, with good thermal and electrical conductivity, is one of the earliest and widely used metals developed by human beings. It mainly exists in the ocean and the earth's crust, with a content of about 0.01%. However, with the rapid development of electronic packaging, aerospace and other industries, traditional metal functional materials have been difficult to meet the high performance requirements of modern industrial technology. At present, integrated circuits and electronic packaging materials produced in the industrial field require not only excellent thermal conductivity, but also good mechanical and mechanical prop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C9/00B22F9/04B22F3/105B22F3/18
CPCC22C1/05C22C9/00B22F9/04B22F3/105B22F3/18B22F2009/042B22F2009/043B22F2003/1051B22F2003/185B22F2998/10
Inventor 修子扬杨文澍柳萌武高辉陈国钦张强芶华松
Owner HARBIN INST OF TECH
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