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Protection method for wet uncapping of plastic package device

A device and wet technology, which is used in the protection field of wet cap opening of plastic encapsulated devices, can solve the problems of inaccurate cap opening area and damaged device function.

Active Publication Date: 2021-09-10
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned shortcomings in the prior art that the wet uncapping method of plastic-encapsulated devices leads to inaccurate uncapping areas and damaged device functions after uncapping, the purpose of the present invention is to provide a protection method for wet uncapping of plastic-encapsulated devices

Method used

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  • Protection method for wet uncapping of plastic package device
  • Protection method for wet uncapping of plastic package device
  • Protection method for wet uncapping of plastic package device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A protection method for wet uncapping of plastic-encapsulated devices, comprising the steps of:

[0038] Step 1) Obtain the size of the plastic-encapsulated device, and design a bracket based on the size of the plastic-encapsulated device;

[0039] The plastic-encapsulated device includes a device body 1 and lead legs 2 drawn from both sides of the device body, and the structural dimensions are as follows: figure 1 As shown; the bracket includes a base 11 and a frame 12 installed on the base 11, the center of the frame 12 is provided with a through groove 5 for inlaying and fixing the device body, and the structural dimensions are as follows figure 2 and image 3 shown;

[0040] Step 2) installing the device body 1 in the through groove 5;

[0041] Step 3) Ultrasonic scanning is performed on the plastic-encapsulated device to be uncapped to obtain the uncapped area 8 and the non-capped area;

[0042] Step 4) Wrap a layer of acid and alkali-resistant tape around the...

Embodiment 2

[0044] Except for the following content, all the other contents are the same as in Example 1.

[0045] like Figure 4 As shown, the side of the frame 12 is provided with a first positioning hole 3, and the side of the base 11 is provided with a second positioning hole 4 at a position corresponding to the first positioning hole 3, the first positioning hole 3 and the second positioning hole 4 The base 11 and the frame 12 are aligned and fixed by the positioning pins 6 .

[0046] The position where the frame 12 is in contact with the base 11 is coated with two-component quick-drying adhesive.

[0047] The base 11 is used to support and protect the bottom of the plastic-encapsulated device, and the center of the frame 12 is provided with a through groove 5 for inlaying and fixing the plastic-encapsulated device, while protecting the lead legs 2 drawn out from both sides of the device. The thickness of the frame 12 is the same as that of the plastic packaged device.

Embodiment 3

[0049] Except for the following content, all the other contents are the same as in Example 1.

[0050] When coating the anti-corrosion peelable glue, apply the anti-corrosion peelable glue at the junction of the acid and alkali-resistant tape and the cap-opening area, and the junction extends 1-1.5mm toward the center of the cap-opening area. Completely cover the winding area 9 of the acid and alkali resistant tape and the extension area 10 of the anti-corrosion peelable adhesive tape. The external dimensions of the base 11 are the same as those of the frame 12, both of which are cuboid structures. like Figure 4 As shown, the side of the frame 12 is provided with a first positioning hole 3, and the side of the base 11 is provided with a second positioning hole 4 at a position corresponding to the first positioning hole 3, the first positioning hole 3 and the second positioning hole 4 The base 11 and the frame 12 are aligned and fixed by the positioning pins 6 . There are f...

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PUM

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Abstract

The invention discloses a protection method for wet uncapping of a plastic package device, and belongs to the field of semiconductor packaging. A support is designed and manufactured according to the size of the plastic package device; the plastic package device to be uncapped is embedded in the support and then fixed and protected through an acid and alkali resistant adhesive tape; a non-uncapped area is coated with an anti-corrosion peelable adhesive, so that a tight protection layer is formed, corrosion of acid liquor to the non-uncapped area in the uncapping process is avoided; and the protection layer is convenient to remove after uncapping, the device pin is not damaged, and the uncapping yield is improved. According to the method, the position of the uncapping area can be accurately controlled according to requirements, and meanwhile, a plastic package body and device pins in the non-uncapping area are protected and prevented from being damaged in the acid etching process.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging and relates to a protection method for wet capping of plastic packaging devices. Background technique [0002] Chip packaging is the shell for installing semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge to communicate the internal world of the chip and the external circuit. The contacts on the chip are connected to the package shell with wires. These pins are connected to other devices through wires on the printed board. During chip testing, the package needs to be opened, which is called uncapping. There are bonding wires, chips, and leads inside the chip. When removing the plastic package of the chip, it is necessary to ensure that the internal structure of the chip is not affected. However, the existing wet capping process requires the use of strong acid to corrode ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6836H01L21/67126H01L2221/6834
Inventor 陈慧贤贾琳王超
Owner XIAN MICROELECTRONICS TECH INST
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