Supercharge Your Innovation With Domain-Expert AI Agents!

Resin composition

A resin composition, epoxy resin technology, applied in epoxy resin coatings, synthetic resin layered products, electronic equipment, etc. The effect of suppressing warpage

Pending Publication Date: 2021-09-17
AJINOMOTO CO INC
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the resin material is highly filled with inorganic fillers, the elastic modulus during curing becomes high, making it difficult to suppress warpage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition
  • Resin composition
  • Resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0248] Hereinafter, the present invention will be specifically described by way of examples. The present invention is not limited to these examples. In addition, in the following description, unless otherwise specified, "part" and "%" which show an amount mean "part by mass" and "% by mass", respectively.

[0249]

[0250] Using a mixer, 30 parts of naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent about 145g / eq.), naphthol aromatic Alkyl type epoxy resin ("ESN-475V" manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent about 332g / eq.) 20 parts, naphthol aralkyl resin ("SN-4110V" manufactured by Nippon Steel Chemical Co., Ltd., Contains 20 parts of methoxy groups), spherical silica ("SO-C2" manufactured by Yaduma Co., Ltd., average particle size 0.5μm, specific surface area 5.8m 2 / g) 400 parts, core-shell type graft copolymer rubber particles ("EXL-2655" manufactured by Dow Chemical Ja...

Embodiment 2

[0252]In addition to changing the amount of naphthol aralkyl resin ("SN-4110V" manufactured by Nippon Steel Chemicals Co., Ltd., containing a part of methoxy group) from 20 parts to 15 parts, and further using triazine-containing cresol novolak resin ("LA-3018-50P" by DIC Corporation, the propylene glycol monomethyl ether solution of 50 mass % of solid content) except 10 parts, it carried out similarly to Example 1, and prepared the resin composition.

Embodiment 3

[0254] In addition to spherical silica ("SO-C2" manufactured by Yaduma Co., Ltd., with an average particle size of 0.5μm and a specific surface area of ​​5.8m 2 The usage amount per g) was changed from 400 parts to 430 parts, and 5 parts of a vinyl phenyl radical polymerizable compound ("OPE-2St" manufactured by Mitsubishi Gas Chemical Co., Ltd.) and a radical polymerization initiator (NOF A resin composition was prepared in the same manner as in Example 2 except for 0.1 part of "PERBUTYL C" manufactured by the company.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Epoxy equivalentaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Login to View More

Abstract

The present invention provides a resin composition with which warpage during curing can be suppressed and with which a cured product having excellent adhesion strength can be obtained. The solution of the present invention is a resin composition containing (A) a fused ring structure-containing epoxy resin, (B) an alkoxy group-containing naphthol aralkyl resin, and (C) an inorganic filler, the content of the component (C) being 70 mass% or more when the non-volatile component in the resin composition is taken as 100 mass%.

Description

technical field [0001] The present invention relates to resin compositions comprising epoxy resins. Furthermore, it is related with the hardened|cured material obtained by using this resin composition, a sheet-like laminated material, a resin sheet, a printed wiring board, and a semiconductor device. Background technique [0002] As a manufacturing technique of a printed wiring board, a manufacturing method based on a buildup method in which insulating layers and conductive layers are alternately laminated (laminated) is known. In the manufacturing method using the stacking method, generally, the insulating layer is formed by curing the resin composition. [0003] Printed wiring boards are generally exposed to a wide range of temperature environments from low temperature environments such as room temperature to high temperature environments such as reflow soldering. Therefore, when the linear thermal expansion coefficient is high and the dimensional stability is poor, the r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09D163/00C09D5/25C09D7/61C08J7/04H05K1/03C08L67/02
CPCC09D163/00C09D5/00C09D7/61C09D7/70C08J7/0427H05K1/0373C08J2367/02C08J2463/00C08L2205/025C08L2205/035C08K2201/005C08K2201/006C08L63/00C08K7/18C08L65/00C08L21/00C08K3/013B32B27/38B32B27/18H05K1/03B32B2457/08C08L2207/53
Inventor 川合贤司
Owner AJINOMOTO CO INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com