Single-component high-thermal-conductivity silica gel and preparation method thereof

Abstract

The invention discloses a single-component high-thermal-conductivity silica gel and a preparation method thereof. The single-component high-thermal-conductivity silica gel is prepared from the following components in parts by weight: 9 to 10 parts of vinyl polydimethylsiloxane, 0.1 to 0.5 part of a cross-linking agent, 0.2 to 0.5 part of a chain extender, 0.2 to 0.5 part of a modifier, 0.01 to 0.05 part of a platinum catalyst, 1 to 2 parts of a coupling agent and 90 to 100 parts of a thermal conductive filler. According to the single-component high-thermal-conductivity silica gel and the preparation method thereof provided by the invention, the high-thermal-conductivity silica gel has the advantages of softness, good fitness and relatively low cost, and is suitable for heat dissipation of electronic equipment.

Description

technical field [0001] The invention belongs to the technical field of single-component silicone gel, and in particular relates to a single-component high thermal conductivity silicone gel and a preparation method thereof. Background technique [0002] With the continuous development of science and technology, electronic products widely enter people's daily life, and the heat dissipation problem of high-performance chips and integrated circuits in electronic equipment needs to be solved urgently. Overheating has a great impact on the life and performance of electronic products. At present, there are mainly two solutions: active cooling and passive cooling. Active heat dissipation is to force the temperature of electronic devices to cool down through heat sinks, air cooling, water cooling, etc. Passive heat dissipation is divided into thermal penetration holes and adding thermal interface materials. The thermal interface materials are simple in process, no damage to equipment...

AI Technical Summary

Problems solved by technology

However, in practical applications, when the filling amount of aluminum powder is high, the viscosity of the system increases and pouring is difficult; when the filling amount is low, it is difficult to form a conductive network and the thermal conductivity is not good.