Composition applied to multi-layer high-frequency copper-clad plate bonding sheet and application thereof
A technology of composition and bonding sheet, which is applied in the direction of non-polymer adhesive additives, application, film/sheet adhesive, etc., can solve the problems of high dielectric performance, poor fluidity, cracks, etc., and achieve particle size Effects of smaller diameter, better adhesion, and enhanced resin fluidity
Inactive Publication Date: 2021-09-28
CHENZHOU GONGTIAN ELECTRONICS CERAMICS TECH
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Problems solved by technology
[0004] The object of the present invention is to provide a composition and its application applied to multi-layer high-frequency copper-clad laminate adhesive sheets, to solve the problem of the existing high-frequency adhesive sheet applied to high-frequency copper-clad laminates proposed in the above-mentioned background technology. High electrical performance, poor fluidity, and problems of voids and cracks after lamination
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[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] A resin composition applied to a bonding sheet for multi-layer lamination of high-frequency copper-clad laminate substrates. The resin composition is formed by mixing a thermosetting hydrocarbon resin, ceramic powder, an organic flame retardant, and an organic solvent. The resin composition The preparation of material, the present invention is described in further detail below with multiple embodiment and comparative example, as shown in table 1 below:
[0028] Table 1 embodiment 1-9 and comparative example 1-2 component and ...
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The invention discloses a composition applied to a multi-layer high-frequency copper-clad plate bonding sheet. The composition is prepared by mixing the following raw materials in parts by weight: (1) 20-40 parts of thermosetting hydrocarbon resin; (2) 20-35 parts of ceramic powder; (3) 5-15 parts of an organic flame retardant; (4) 10-30 parts of an organic solvent; and (5) 1-5 parts of an initiator. The prepared bonding sheet is low in dielectric property, cavities and cracks cannot be generated after the bonding sheet and a high-frequency board are laminated in a multi-layer mode, and various electrical performance failures caused by long-term use of a product are avoided.
Description
technical field [0001] The invention relates to the technical field of high-frequency copper-clad laminates, and more specifically relates to a composition applied to bonding sheets of multi-layer high-frequency copper-clad laminates and its application. Background technique [0002] Copper clad laminate is a common material for printed circuit board substrates of electronic equipment, but as a substrate for printed circuit boards of outdoor electronic equipment, it needs to have strong flame retardant, aging resistance and moisture resistance. In the era of big data, the information of electronic products Processing is constantly developing towards high-frequency signal transmission and high-speed digitalization. In order to ensure that electronic products have good signal transmission quality under the condition of high-frequency signal transmission, the transmission line in the conductive copper foil of the copper-clad laminate and the connected electronic components need...
Claims
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IPC IPC(8): C09J7/30C09J7/10C09J147/00C09J123/26C09J11/04C09J11/06B32B17/02B32B17/06B32B7/12H05K1/03
CPCC09J7/30C09J7/10C09J147/00C09J11/04C09J11/06B32B17/02B32B17/06B32B7/12H05K1/0366H05K1/0373C08K2201/011C08K2003/2241C08K2003/2237C08L2203/20B32B2262/101B32B2457/08C08L47/00C08L23/26C08K3/36C08K3/22C08K5/3415C08K5/03C08K5/5313C08K7/14
Inventor 陈功田李海林邓万能刘俊琨付尧刘明
Owner CHENZHOU GONGTIAN ELECTRONICS CERAMICS TECH