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Display panel and method of making the same

A technology for a display panel and a manufacturing method, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the accuracy of mass transfer, abnormal position of light-emitting units, and weak bonding between driving substrates and light-emitting units.

Active Publication Date: 2022-04-29
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Claims
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Problems solved by technology

[0003] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a method for manufacturing a display panel, which aims to solve the problem of weak bonding between the driving substrate and the light-emitting unit during the mass transfer of the existing display panel, which is prone to occur. The abnormal position of the light-emitting unit reduces the technical problem of mass transfer accuracy

Method used

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  • Display panel and method of making the same

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Embodiment Construction

[0048] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0050]Solder paste reflow soldering technology is only applicable to display pane...

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Abstract

The present application relates to a display panel and a manufacturing method thereof. The manufacturing method of the display panel includes sequentially setting a first adhesive layer and a second adhesive layer on the surface of the driving substrate, the first adhesive layer includes conductive particles; A plurality of light-emitting units arranged in an array are adhered on one side; the second adhesive layer is semi-cured; and the first adhesive layer and the second adhesive layer are cured, and the plurality of Each light emitting unit is electrically connected to the driving substrate through the conductive particles. The manufacturing method of the display panel of the present application increases the bonding performance between the light-emitting unit and the driving substrate, so that the light-emitting unit can be better positioned with the electrodes on the driving substrate when the mass transfer is performed, and the position of the light-emitting unit is increased. Accuracy, thereby improving the yield rate of display panel production, while using the retaining wall structure formed by the bonding process to effectively reduce the risk of color shift.

Description

technical field [0001] The present application relates to the field of display panels, in particular to a display panel and a manufacturing method thereof. Background technique [0002] Due to the limitation of the size of the LED in the Micro Light Emitting Diode (Micro-LED) display panel, the size of the P electrode and the N electrode of the LED is only more than ten microns. The traditional solder paste reflow soldering technology is only suitable for display panels with LEDs larger than 100 μm in size and with a spacing between adjacent LEDs larger than 400 μm, and is not suitable for micro-LED display panels. Most of the existing micro light-emitting diode display panels adopt two methods of indium tin oxide (ITO) eutectic bonding. The ITO eutectic method requires a high degree of metal lattice matching, and ITO has low affinity with most materials. Usually, evaporation of Au or Cu is required, and the process is complicated and the cost is high. Contents of the inv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/44H01L33/52H01L33/58H01L27/12H01L27/15
CPCH01L33/62H01L33/58H01L33/52H01L33/44H01L27/153H01L27/1214H01L2933/0066H01L2933/0058H01L2933/005H01L2933/0025
Inventor 付杰刘政明龚立伟袁盼张国建
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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