Electrochemical copper plating method based on fully-additive process

Abstract

The invention belongs to the technical field of PCBs (printed circuit boards), and provides an electrochemical copper plating method based on a fully-additive process. The electrochemical copper plating method is characterized by comprising the following steps of drilling, glue residue removal, film drying, electrochemical copper plating and etching, wherein the electrochemical copper plating process specifically comprises the steps of: S1, adopting a catalytic reduction system, adjusting an electrochemical copper plating reaction system, and forming a uniform and compact copper layer on the surface of a base material or a hole in a copper deposition manner; and S2, in an existing plating solution system, achieving copper layer thickening by taking copper as a soluble anode and titanium as a cathode through electroplating. According to the electrochemical copper plating method, the copper plating rate can be increased, the copper plating binding force and the ductility of the copper layer can be guaranteed, the generation of a redox reaction byproduct Cu2O is controlled through a new graft polymerization catalysis system, the generation probability of disproportionated reaction is reduced, and the reaction rate and stability of an electrochemical copper plating system in a non-current plating layer are controlled.

Description

technical field [0001] The invention belongs to the technical field of PCB, and in particular relates to an electrochemical copper plating method based on a full addition method. Background technique [0002] The manufacturing process of printed circuit board (PCB) mainly includes subtractive method, semi-additive method, full additive method and so on. Among them, the full additive method refers to selectively forming a conductive layer on an insulating substrate. This method has many advantages, such as avoiding side erosion, reducing the thickness of HDI (high-density interconnect) boards, and greatly reducing the waste of copper resources. Therefore, it has received extensive attention and research. However, the traditional full-addition method uses insulating materials as the substrate, and the conductive seed layer must be made first when forming the conductive layer, which not only increases the process, prolongs the production cycle, but also increases the pollution...

AI Technical Summary

Problems solved by technology

[0004] 1. After electroless copper deposition, the surface of the board is easy to oxidize and blacken, and the thickness of the copper deposition layer itself is relatively low. There is a large reliability risk in the process of copper deposition to electroplating transportation. At present, various technical means can meet the requirements of daily production. Demand, but the cost increase is more obvious;

[0005] 2. The interval between electroplating and copper sinking is long, and a layer of electroplated copper layer needs to be thickened by electroplating on the surface of the copper sinking layer, resulting in a long process and complicated procedures;

[0006] 3. The copper surface adhesion of the general full addition method is poor, and the heat resistance and reliability standards are quite different from the existing technical standards.