33results about How to "Achieve thickening" patented technology

The invention relates to a vertical spinning machine comprising a machine body component, a main shaft component, a spinning wheel component, a tail jack component and a mechanical arm component as well as electronic control, hydraulic, lubrication, cooling and protection systems; the spinning wheel component of the vertical spinning machine is composed of three groups of spinning wheels distributed by 120 DEG, and a group of auxiliary spinning wheels; and each group of spinning wheels can achieve axial and radial servo feed motion alone. According to the vertical spinning machine stated in the invention, new technological methods, such as stagger spinning, local thickening and splitting, can be achieved, and the process flow is simplified; and the processing efficiency is improved, and the manufacturing cost is saved. The batch production of automobile clutch shell parts can be achieved, and the defects of existing equipment for producing such parts in China are overcome; and the gapbetween the automobile manufacturing field and foreign technical level is narrowed.

The invention discloses a special composite velocity adjusting agent for high-lift pumped concrete, an adjusting agent preparation method and an application method. The special composite velocity adjusting agent for the high-lift pumped concrete comprises the following components in percentage by mass: 30-70% of a viscosity reducer, 15-30% of a thickening agent, 0.1-1% of an inner maintenance agent, 0.01-0.1% of a stabilizer and 10-20% of packing. The special composite velocity adjusting agent is stable in property and simple to use, is directly put into concrete in a dry powder mode, is capable of effectively adjusting plasticization viscosities and homogeneity of a pumped concrete mixture after being uniformly stirred, is capable of preventing phenomena such as easy separation, water secretion and layering of large flowing pumped concrete, is particularly beneficial to pumping application of the high-lift (ultrahigh elevation) pumped concrete, and is capable of reducing pumping pipeline pressure along the way and preventing accidents such as pipeline blocking and pipeline explosion caused by large pumping resistance.

The invention provides a carbon dioxide thickening fracturing system, which is suitable for the field of fracturing transformation. The carbon dioxide thickening fracturing system comprises an output system, a fracturing fluid treatment system and a liquid CO2 treatment system, wherein the fracturing fluid treatment system comprises a liquid CO2 thickening agent stock solution treatment system and a fracturing fluid thickening system. A technological method comprises the following step that an extension short joint 21, a safety joint 23, a low-temperature high-pressure air-tight sealing hydraulic anchor 24, a low-temperature high-pressure air-tight sealing anchoring type packer 25, a sand blasting nozzle 26 and a fracturing well completion oil pipe 22 are put into a well together through a well repairing machine. According to the carbon dioxide thickening fracturing system, thickening of liquid carbon dioxide, fracture forming of the thickened liquid carbon dioxide, sand carrying of the thickened liquid carbon dioxide and liquid together and the like are achieved by designing fracturing fluid and liquid carbon dioxide pumping programs, the influence of liquid on a reservoir can be effectively reduced, the flowback rate is increased, the reservoir transformation effect is guaranteed to the maximum extent, and the single well yield is increased.

The invention discloses a PCB secondary circuit gold plating process, which comprises the following steps of: grinding and cleaning a PCB through a horizontal line to remove an oxide layer on the surface of the PCB, printing a layer of photosensitive solder resist ink on the surface of the PCB in a silk screen skip printing manner, transferring the PCB into a 65 DEG C oven, baking the photosensitive solder resist ink for 2 hours, and feeding the PCB into an exposure machine for exposing for 20 seconds; then transferring into a sodium carbonate solution with the mass fraction of 1% for cleaning, removing the unexposed photosensitive solder resist ink to expose a gold plating area pattern, and then feeding into a oven at 135-140 DEG C for drying the PCB for 30 minutes. According to the invention, the conductive windows are formed during two times of gold plating, the positions of the conductive windows can be adjusted according to actual requirements, the reject ratio of gold staining ofthe conductive windows is reduced by forming the conductive windows, the gold salt cost is saved, and the purpose of thickening a gold layer can be achieved through two times of gold plating.

The invention belongs to the technical field of PCBs (printed circuit boards), and provides an electrochemical copper plating method based on a fully-additive process. The electrochemical copper plating method is characterized by comprising the following steps of drilling, glue residue removal, film drying, electrochemical copper plating and etching, wherein the electrochemical copper plating process specifically comprises the steps of: S1, adopting a catalytic reduction system, adjusting an electrochemical copper plating reaction system, and forming a uniform and compact copper layer on the surface of a base material or a hole in a copper deposition manner; and S2, in an existing plating solution system, achieving copper layer thickening by taking copper as a soluble anode and titanium as a cathode through electroplating. According to the electrochemical copper plating method, the copper plating rate can be increased, the copper plating binding force and the ductility of the copper layer can be guaranteed, the generation of a redox reaction byproduct Cu2O is controlled through a new graft polymerization catalysis system, the generation probability of disproportionated reaction is reduced, and the reaction rate and stability of an electrochemical copper plating system in a non-current plating layer are controlled.

The embodiment of the invention discloses a printed electronic device and a manufacturing method, manufacturing equipment and an assembly line thereof, and relates to the technical field of printed electronic additive manufacturing. The manufacturing method of the printed electronics comprises the following steps: manufacturing a coating adhered with low-melting-point metal on a base material notadhered with the low-melting-point metal, wherein the pattern of the coating is consistent with that of a target printed electron; forming a first metal layer with a first thickness on the coating byutilizing low-melting-point metal, and enabling the first metal layer to become a second metal layer with a second thickness through a metal infiltration effect, wherein the second thickness is greater than the first thickness. According to the invention, the metal infiltration effect between the low-melting-point metal and the low-melting-point metal is utilized to thicken the low-melting-point metal printed electrons, so that the defects of high resistance and poor conductivity caused by too thin low-melting-point metal printed electrons are effectively overcome.

The invention relates to a method for manufacturing a container component of a sealing type switch device, and a switch device. According to the invention, a method for manufacturing container components (6,20,21) of a sealing typoe switch device is provided. The method requires low cost. Pressure-bearing capability of teh container components are remainded; the method comprises structuring a cylindrical pipe (2,12) via welding between a rolling sheet (1,7) and abutted-sides (3,13) of the rolling sheet (1,7), and bending a flange (5,16,17) on at least one pipe end part (4) of the cylindrical pipe (2,12).

The invention discloses a compound medical food and a preparation method thereof. The compound medical food is composed of betaine or betaine monohydrate, modified starch, dietary fiber and an aqueous medium, wherein per liter of the aqueous medium contains 5g-200g of betaine or betaine monohydrate, 50mg-2000mg of modified starch and 5mg-200mg of dietary fiber. Experimental results show that by virtue of doping of the modified starch, a compound betaine solution has better viscosity, forms physical gel and restores to a flow state under the effect of shearing force. Furthermore, the compound medical material disclosed by the invention can be prepared under mild conditions, and the preparation method is simple. The compound medical food disclosed by the invention has certain adjuvant treatment effects on human cardiovascular diseases, nervous diseases, liver diseases and hyperhemicysteinuria and can be used for health or neurology department clinical medicine.

The invention discloses a powdery resin filter online film laying system. The system is characterized in that a film laying case is provided with an inclined insert type electric stirrer and a floating ball liquid level switch. The system has the following advantages: 1, the filter element of a filter is repaired and thickened in the running process, so the running period is improved; 2, the adoption of the inclined insert type electric stirrer prevents a material liquid in the film laying case from forming a vortex, is in favor of the full and uniform mixing of the material liquid, and is also in favor of conveying the material liquid; 3, an advanced film laying pump adopts a medium pressure resistant pump shell, and is a metering pump capable of conveying a slurry, and the arrangement of a safe valve at the outlet tube of the pump is helpful for avoiding impact from a medium pressure system; 4, the powdery resin filter online film laying system is connected with the powdery filter, and has a running direction consistent with the filter, so online uniform laying and difficult shedding of a powdery resin are benefited; and 5, the powdery resin filter online film laying system has a small occupied area, solves a problem that the a filter which cannot be laid with a film under a medium pressure running condition, improves the use efficiency of the filter, reduces the running cost and reduces the manual labor.

The invention provides a physical vapor deposition hard coating multilayer hexagonal structure design toughening and toughness evaluation method. The design of the multilayer hexagonal structure of the hard coating for toughening specifically refers to alternate deposition of a soft layer and a hard layer. In the soft layer deposition process, the regular hexagon through holes are designed in the baffles, soft layers evenly distributed in the one-third area of the base body are deposited, and the other parts are shielded by the baffles. The coating toughening design of one modulation period is completed through alternate deposition of the soft layers and the hard layers for three times, and modulation of multiple periods can be achieved according to requirements. And in one modulation period, the regular hexagonal soft layer area is not overlapped in the same area of the substrate when the soft layer is deposited each time. According to coating toughness evaluation, the coatings are deposited on the two base bodies at the same time, the end faces of the two base bodies are completely in butt joint, and it is guaranteed that the butt joint faces are smooth and have the good fitting degree. After a coating is deposited on the sample on the special clamp, the fracture moment and surface appearance of the coating are tested on a toughness testing device. And the toughness is evaluated by analyzing the fracture moment, the loading force-displacement curve and the fracture morphology.