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Forming method of foam board

A molding method and foam board technology, applied in the field of foam board molding, can solve the problems of high molding cost, easy generation of waste, many post-processing or pre-processing procedures, etc., so as to achieve reduced production time, less waste, and reduced post-processing procedures. Effect

Pending Publication Date: 2021-10-08
重庆泛锐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the preparation process of the above two schemes is simple, the molding cost is relatively high, and there are many post-processing or pre-processing steps, and waste is easy to be generated. Therefore, it is imperative to reduce the processing process, reduce the cost, and reduce the generation of waste.

Method used

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  • Forming method of foam board
  • Forming method of foam board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A method for molding a foam board, the foam board comprising an upper panel layer, a lower panel layer and a foaming layer between the two, the upper panel layer and the lower panel layer are composited with glass fiber reinforced epoxy resin Material, forming method comprises the steps:

[0035] (1) According to the size of the foam board to be prepared, cut three pieces of prepreg, which are marked as 1# prepreg, 2# prepreg and 3# prepreg, 1-3# prepreg Both are glass fiber reinforced epoxy resin-based prepregs, of which 1# prepreg corresponds to the four sides of the foam board, 2# prepreg and 3# prepreg correspond to the upper and lower panels of the foam board respectively ; Roll the 1# prepreg into a hollow cylindrical structure and glue and fix the two ends of the intersection line of the cylindrical structure, and then glue and fix the 2# prepreg and the 3# prepreg to the cylindrical structure respectively. upper and lower ends;

[0036] (2), using such as Fi...

Embodiment 2

[0041] A method for forming a foam board, the foam board comprising an upper panel layer, a lower panel layer and a foaming layer between the two, the upper panel layer and the lower panel layer are composited with carbon fiber reinforced unsaturated polyester Material, forming method comprises the steps:

[0042] (1) According to the specification and size of the foam board to be prepared, cut six prepregs and mark them as 1′# prepreg, 2′# prepreg, 3′# prepreg, 4′# prepreg Prepregs, 5'# prepregs and 6'# prepregs, 1'-6'# prepregs are all carbon fiber reinforced unsaturated polyester-based prepregs, of which 1'-4'# prepregs are respectively Corresponding to the front, rear, left, and right sides of the foam board, 5'# prepreg and 6'# prepreg correspond to the upper and lower layers of the foam board respectively;

[0043] (2), using such as Figure 1-3 As shown in the mold, the mold includes an upper mold 1, a lower mold 2, two sliders 3, and an airbag bag 4; the upper mold 1...

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Abstract

The invention belongs to the field of preparation of foam boards, and discloses a forming method of a foam board. The forming method of the foam board comprises the following steps of: (1) preparing a prepreg according to the specification and size of the foam board to be prepared; (2) laying a layer of release film on the inner surface of a mold with an air bag and air holes in advance, and then forming a foaming cavity; (3) heating and pressurizing the mold obtained in the step (2); (4) cooling, deflating and opening the mold, and closing the whole mold after the air bag is removed; and (5) preparing resin foaming mixed slurry, injecting the resin foaming mixed slurry into the foaming cavity in the mold until the foaming cavity is full, carrying out heat-preservation and pressure-preservation foaming, and opening the mold to obtain the foam board. According to the forming method of the foam board, post-treatment procedures are reduced, and the phenomenon of layering caused by infirm bonding basically does not exist on the periphery of the plate.

Description

technical field [0001] The invention belongs to the field of preparation of foam boards, and in particular relates to a molding method of foam boards. Background technique [0002] At present, the molding methods of foam board mainly include two kinds of adhesive molding and injection foaming molding; the adhesive molding method is formed by bonding the panel layer and the finished foam board layer. The low bond strength of the panel layer leads to serious delamination, and the edge of the plate needs to be treated to reduce the delamination; the injection foam molding method needs to first form a closed cavity with the panel layer and the frame, and then inject it into the closed cavity Foaming Mix raw materials and foam molding in the cavity. This method needs to prepare the frame mold and pre-bond with the panel layer, and then remove the frame mold after molding. Although the preparation process of the above two schemes is simple, the molding cost is relatively high, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/34
CPCB29C70/345
Inventor 谭志均杨剑波杨宇谭自成
Owner 重庆泛锐科技有限公司
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