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A kind of graphene thermal interface material production device and preparation method thereof

A technology of thermal interface materials and production equipment, applied in the direction of graphene, heat exchange materials, chemical instruments and methods, etc., to achieve the effect of improving the quality of finished products, excellent thermal conductivity, and ensuring uniformity

Active Publication Date: 2022-01-14
ZHEJIANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as a typical two-dimensional sheet material, the ultrahigh thermal conductivity of graphene is only shown in the in-plane direction, and its thermal conductivity in the out-of-plane direction is less than 3 W / mK

Method used

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  • A kind of graphene thermal interface material production device and preparation method thereof
  • A kind of graphene thermal interface material production device and preparation method thereof
  • A kind of graphene thermal interface material production device and preparation method thereof

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Embodiment

[0041] see Figure 1-7 , a graphene thermal interface material production device, comprising a fixed frame 1, the upper end of the fixed frame 1 is provided with a transmission box 2, the inner wall of the transmission box 2 is provided with a rotation fixing seat 3, and the rotation fixing seat 3 is provided with a plurality of ring arrays, The center of the transmission box 2 is concentrically provided with a microneedle cutting seat 6, and the lower end of the fixed frame 1 is provided with a drive mechanism 4, the drive mechanism 4 includes an indexing turntable 7 and a synchronous deflection motor 11, and the upper end of the output turntable of the indexing turntable 7 is connected to the microneedle cutting machine. The seat 6 is fixedly connected, and the middle part of the output turntable is rotated with a synchronous chassis 5, the synchronous chassis 5 and the rotation fixed seat 3 are connected through a synchronous deflection transmission mechanism 10, and the low...

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Abstract

The invention discloses a graphene thermal interface material production device and a preparation method thereof, which belong to the technical field of thermal interface material production. A graphene thermal interface material production device includes a fixed frame, and a transmission box is arranged at the upper end of the fixed frame , the inner wall of the transmission box is provided with a rotation fixing seat, and the rotation fixing seat is arranged in a plurality of circular arrays, the center of the transmission box is concentrically provided with a microneedle cutting seat, and the lower end of the fixing frame is provided with a driving mechanism, so The driving mechanism described above includes an indexing turntable and a synchronous deflection motor. The set indexing turntable drives the microneedle cutting seat to rotate periodically, and the microneedle cutting seat drives the microneedle assembly to carry out the two-dimensional nanosheet dispersion coated on the thermal interface substrate. Microneedle cutting prepares a thermal interface material with a high vertical orientation. The thermal interface material has a radial structure formed by microneedle cutting. This device is low in price and simple in process, suitable for large-scale continuous production and industrial scale-up applications.

Description

technical field [0001] The invention relates to the technical field of thermal interface material production, and more specifically, to a graphene thermal interface material production device and a preparation method thereof. Background technique [0002] With the development of electronic packaging towards miniaturization, integration, and intelligence, the power density per unit area inside electronic devices has also risen sharply. If the heat generated by electronic products cannot be discharged in time, it will greatly affect the working performance and service life of the chip. Efficient thermal management design is the key to solving this problem. The core is to prepare heat sinks with high vertical thermal conductivity. The interface material is filled between the heat source and the heat sink to reduce the interface thermal resistance, so that heat can be quickly transferred from the heat source to the heat sink. At present, the content of thermally conductive fill...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/14C01B32/184
CPCC09K5/14C01B32/184
Inventor 高超沈颖曹敏
Owner ZHEJIANG UNIV
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