Infrared temperature measurement sensing chip

Abstract

The invention provides an infrared temperature measurement sensing chip, and belongs to the technical field of temperature measurement sensing chips. The infrared temperature measurement sensing chip comprises a glass wafer provided with a groove and a thermopile microstructure film which is bonded by a silicon-glass wafer and covers the groove. An electrode through hole located in the glass wafer is formed around the groove, and metal is filled in the electrode through hole to serve as a wire; the thermopile microstructure film comprises an infrared absorption layer bonded to the upper surface of a supporting layer and a thermopile module bonded to the lower surface of the supporting layer, the thermopile module covers the upper portion of the groove to form a closed cavity in a vacuum state, the input end or the output end of the thermopile module is connected with one end of the electrode through hole, and the other end of the electrode through hole is connected with an external electrode. According to the infrared temperature measurement sensing chip provided by the invention, heat loss caused by gas heat convection in a normal temperature environment is avoided, and the sensitivity of temperature measurement is improved.

Description

technical field [0001] The invention relates to the technical field of temperature-measuring sensor chips, in particular to an infrared temperature-measuring sensor chip. Background technique [0002] Infrared detectors are the core devices of infrared thermal imaging systems, infrared gas and temperature sensors, and are mainly divided into two types: cooling type and non-cooling type. Compared with the cooled infrared detector, the uncooled infrared detector does not need to install a cooling device in the system, and has the characteristics of small size, light weight and low power consumption. Infrared sensors and infrared thermal imaging products using uncooled infrared detectors have more advantages in terms of overall machine working life, reliability, volume, weight, and cost performance, and are more suitable for popular use in the civilian field. [0003] Uncooled infrared detectors mainly include pyroelectric detectors, thermopile detectors and microbolometers. ...

AI Technical Summary

Problems solved by technology

The thermopile film structure is fragile and can easily crack during coating operations leading to device damage

In addition, due to different batches of packages, different instruments and equipment, and differences in staff operations, it may cause inconsistencies in chip performance

[0005] At present, infrared temperature sensing chips based on MEMS technology are widely used. Because the normal temperature environment has an important impact on the temperature measurement sensitivity, it is mainly manifested in the fact that the gas heat convection in the normal temperature environment will take away part of the heat, resulting in temperature measurement sensitivity. Inaccurate

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