Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vertical cavity surface emitting laser and manufacturing method thereof

A vertical-cavity surface-emitting, manufacturing method technology, applied in the field of vertical-cavity surface-emitting lasers and their production, can solve the problems of high optical loss and affect the overall performance of the laser, and achieve the effect of improving the overall performance

Inactive Publication Date: 2021-10-22
BEIJING UNIV OF POSTS & TELECOMM
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high-speed data transmission of vertical cavity surface emitting lasers in the prior art is accompanied by problems such as high optical loss, which affects the overall performance of the laser.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vertical cavity surface emitting laser and manufacturing method thereof
  • Vertical cavity surface emitting laser and manufacturing method thereof
  • Vertical cavity surface emitting laser and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0084] The following will clearly and completely describe the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0085] In order to make the above objects, features and advantages of the present application more obvious and comprehensible, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0086] refer to figure 1 , figure 1 A schematic cross-sectional structure diagram of a vertical cavity surface emitting laser provided for an embodiment of the present invention, the vertical cavity surface emitt...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
reflectanceaaaaaaaaaa
Login to View More

Abstract

The invention provides a vertical cavity surface emitting laser and a manufacturing method thereof. The laser comprises a substrate which is provided with a first surface and a second surface opposite to each other, a device stacking structure which is arranged on one side, facing the first surface, of the substrate, and comprises an N-type DBR layer arranged on one side, facing the first surface, of the substrate, an active region which is arranged on one side, deviating from the substrate, of the N-type DBR layer, a P-type DBR layer which is arranged on one side, deviating from the N-type DBR layer, of the active region, and a mode filter structure which is arranged on one side, deviating from the active region, of the P-type DBR layer and comprises an anti-phase layer with a light emitting hole. According to the technical scheme, the single-mode output of the vertical cavity surface emitting laser is realized, the optical loss and the threshold current are reduced, the modulation rate is improved, and the overall performance of the laser is further improved.

Description

technical field [0001] The invention relates to the field of laser technology, and more specifically, to a vertical cavity surface emitting laser and a manufacturing method thereof. Background technique [0002] Since the advent of vertical cavity surface emitting lasers, due to their small size, low threshold current, single longitudinal mode operation, high modulation frequency, easy fiber coupling, and integrated arrays, they have been widely used in optical communications, optical interconnections, and optical information processing. field. [0003] With the emergence of applications such as 5G and lidar, people have put forward more advanced technical requirements for optical interconnection technology based on optical fiber. How to reduce the energy consumption of the internal optical interconnection during data transmission while ensuring high-speed data transmission has become one of the research directions of those skilled in the art. [0004] At present, 850nm, 8...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/183H01S5/10
CPCH01S5/18302H01S5/18361H01S5/1039
Inventor 王俊王海静黄永清任晓敏刘凯
Owner BEIJING UNIV OF POSTS & TELECOMM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com