Silicon wafer feeding calibration device of photoetching machine

A calibration device and lithography machine technology, applied in the field of lithography machines, can solve the problems of inconvenient calibration work, clip damage, inconvenient automatic reset of the calibration device, etc., to achieve the effect of facilitating calibration work and preventing offset

Inactive Publication Date: 2021-10-26
张含妮
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some problems with the current feeding calibration device: 1. The calibration of the film is not accurate enough, and the calibration process is easy to cause damage to the clip; 2. The calibration device is not easy to automatically reset, and it is not convenient to perform calibration work again

Method used

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  • Silicon wafer feeding calibration device of photoetching machine
  • Silicon wafer feeding calibration device of photoetching machine
  • Silicon wafer feeding calibration device of photoetching machine

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Embodiment

[0026] A silicon wafer feeding calibration device for a lithography machine, comprising a housing 1, a connecting seat 18, a threaded sleeve 23, a threaded rod 24, a second rotating shaft 37, and a positioning seat 38, the lower end of the housing 1 is fixedly equipped with a support seat 2 A top cover 3 is fixedly installed on the upper end of the housing 1, a first motor 4 is fixedly installed on the outer side of the housing 1, and a first rotating shaft 5 of the first motor 4 is rotationally connected with the housing 1, and the first rotating shaft The outer side of 5 is fixedly sleeved with a transmission roller 6, the outer side of the transmission roller 6 is fixedly sleeved with a rotating roller 7, the outer side of the rotating roller 7 is sleeved with a conveyor belt 8, and the outer side of the conveyor belt 8 is connected with a silicon chip. 28, the outer side of the upper cover 3 is fixedly installed with a fixed block 9, the inside of the fixed block 9 is slida...

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Abstract

The invention discloses a silicon wafer feeding calibration device of a photoetching machine, which comprises a shell, a connecting seat, a threaded sleeve, a threaded rod, a second rotating shaft and a positioning seat, the lower end of the shell is fixedly provided with a supporting seat, the upper end of the shell is fixedly provided with an upper cover, and the outer side of the shell is fixedly provided with a first motor; a first rotating shaft of the first motor is rotationally connected with the shell, the outer side of the first rotating shaft is fixedly sleeved with a transmission roller, the outer side of the transmission roller is fixedly sleeved with a rotating roller, the outer side of the rotating roller is sleeved with a conveying belt, the outer side of the conveying belt is in contact connection with a silicon wafer, and a fixing block is fixedly installed on the outer side of the upper cover. And a fixing rod is slidably connected into the fixing block, a fixing plate is fixedly installed on the outer side of the fixing rod, and the fixing plate is slidably connected with the upper cover. The invention relates to a silicon wafer feeding calibration device of a photoetching machine. The silicon wafer feeding calibration device has the characteristics of accurate calibration and automatic reset.

Description

technical field [0001] The invention belongs to the technical field of photolithography machines, in particular to a silicon wafer feeding calibration device for photolithography machines. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer lithography of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine) . Lithography machine is the most critical equipment in the process of integrated circuit processing. When the lithography machine performs surface lithography on silicon wafers, it is necessary to take out the silicon wafers from the cassette one by one. At present, most of the silicon wafers are round in shape. Therefore, the silicon wafers only need to be directly fed into the lithography. Work place is enough. However, there are some problems in the ...

Claims

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Application Information

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IPC IPC(8): G03F7/20H01L21/68
CPCG03F7/707G03F7/70733G03F7/70775H01L21/68
Inventor 张含妮
Owner 张含妮
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