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Method for preparing interdigital chip type miniature supercapacitor through 3D printing technology

A supercapacitor and 3D printing technology, applied in the manufacture of hybrid capacitor electrodes, hybrid capacitor current collectors, and hybrid/electric double layer capacitors, etc., can solve the problems of unsatisfactory mechanical properties of microcapacitor electrode active materials, and achieve good mechanical properties. The effect of increasing the load and increasing the capacitance

Pending Publication Date: 2021-10-26
WUHAN INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Micro-supercapacitors are composed of current collectors, electrode materials, separators and electrolytes, but the mechanical properties of micro-capacitor electrode active materials are not ideal, and materials with certain mechanical properties and flexibility are required as the substrate for carrying electrode active materials.

Method used

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  • Method for preparing interdigital chip type miniature supercapacitor through 3D printing technology
  • Method for preparing interdigital chip type miniature supercapacitor through 3D printing technology
  • Method for preparing interdigital chip type miniature supercapacitor through 3D printing technology

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Experimental program
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Effect test

Embodiment 1

[0032] A method for preparing interdigitated chip-type micro-supercapacitors by 3D printing technology is provided, comprising the steps of:

[0033] (1) Design of the base model: the bottom plate of the base is 3 mm thick, 50 mm long, and 40 mm wide. The electrode pattern groove is 0.5mm deep, and the electrode pattern is two interdigitated electrodes. The output end of each electrode is 4mm×4mm, and each electrode has five electrode fingers of 7.5mm×1.5mm. The spacing is 3mm. The distance between the electrode fingers and the other electrode is 1.5 mm.

[0034] (2) 3D printing of TPU electrodes: select commercial TPU filaments. Use 3D printing technology to print the mold. The nozzle temperature during printing is 150°C, the filling density is 100%, the filling pattern is grid, the layer height is 0.1mm, and the printing accuracy is 0.1mm. After the 3D printing process is finished, it is cooled at room temperature and removed from the substrate with a scraper to obtain an...

Embodiment 2

[0040] A method for preparing interdigitated chip-type micro-supercapacitors by 3D printing technology is provided, comprising the steps of:

[0041] (1) Design of the base model: the bottom plate of the base is 3 mm thick, 50 mm long, and 40 mm wide. The electrode pattern groove is 0.5mm deep, and the electrode pattern is two interdigitated electrodes. The output end of each electrode is 4mm×4mm, and each electrode has five electrode fingers of 7.5mm×1.5mm. The spacing is 3.5mm. The distance between the electrode fingers and the other electrode is 1.5mm.

[0042] (2) 3D printing of TPU electrodes: select commercial TPU filaments. Use 3D printing technology to print the mold. The nozzle temperature during printing is 150°C, the filling density is 100%, the filling pattern is grid, the layer height is 0.1mm, and the printing accuracy is 0.1mm. After the 3D printing process is finished, it is cooled at room temperature and removed from the substrate with a scraper to obtain a...

Embodiment 3

[0046] A method for preparing interdigitated chip-type micro-supercapacitors by 3D printing technology is provided, comprising the steps of:

[0047] (1) Design of the base model: the bottom plate of the base is 3 mm thick, 50 mm long, and 40 mm wide. The electrode pattern groove is 0.5mm deep, and the electrode pattern is two interdigitated electrodes. The output end of each electrode is 4mm×4mm, and each electrode has five electrode fingers of 7.5mm×2mm. The distance between the electrode fingers on the same side is 5mm. The distance between the electrode fingers and the other electrode is 0.5mm.

[0048] (2) 3D printing of TPU electrodes: select commercial TPU filaments. Use 3D printing technology to print the mold. The nozzle temperature during printing is 150°C, the filling density is 100%, the filling pattern is grid, the layer height is 0.1mm, and the printing accuracy is 0.1mm. After the 3D printing process is finished, it is cooled at room temperature and removed f...

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Abstract

The invention discloses a method for preparing an interdigital chip type miniature supercapacitor through a 3D printing technology. The method comprises the following steps of: 1) designing an interdigital chip type electrode pattern by utilizing modeling software; 2) taking a polymer wire as a raw material, and printing an interdigital chip type electrode concave die which is composed of two parts, namely an interdigital chip type electrode pattern composed of a bottom plate and a groove, by utilizing a 3D printing technology; 3) sequentially depositing a silver current collector, an electrode active material and a silver current collector in the groove through a dispensing process to obtain an interdigital electrode; and 4) coating an electrolyte on the interdigital part of the interdigital electrode, connecting the two ends of the electrode with copper sheets, and carrying out plastic packaging to prepare the interdigital chip type miniature supercapacitor. The method is simple in process, high in manufacturing precision and low in cost, the electrode pattern can be designed by itself, the capacity of the electrode active substance of the obtained micro supercapacitor in unit area is large, the energy density of the micro supercapacitor is high, meanwhile, the tensile property is excellent, and the method is suitable for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of micro-supercapacitors, and in particular relates to a method for preparing interdigitated chip-type micro-supercapacitors by 3D printing technology. Background technique [0002] In recent years, with the rapid development of microelectronics technology, a series of new electronic products such as wearable, miniaturized, and highly integrated have begun to appear. Therefore, the energy storage and supply of these emerging electronic products has become an urgent problem to be solved. The new micro flexible supercapacitor has the advantages of integration, high power density, fast charge and discharge speed, reversible energy storage process, safety and environmental protection, etc., and has become a research hotspot for emerging micro energy storage devices in recent years. Micro-supercapacitors are composed of current collectors, electrode materials, separators, and electrolytes. However, the mechanical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G11/84H01G11/86H01G11/68H01G11/24H01G11/26H01G11/28
CPCH01G11/84H01G11/86H01G11/68H01G11/24H01G11/26H01G11/28Y02E60/13
Inventor 孙义民陈振宇周爱军
Owner WUHAN INSTITUTE OF TECHNOLOGY
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