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PCB shielding case welding process

A technology of PCB board and welding process, which is applied in the field of PCB board shielding cover welding process and its preparation, can solve the problems of low welding efficiency, time-consuming and laborious welding of PCB board and shielding cover, inaccurate welding, etc., and achieve high welding efficiency and tin Good paste printing effect and accurate printing effect

Inactive Publication Date: 2021-11-02
汪爱民
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the invention: The present invention is to solve the technical problems of time-consuming and labor-intensive welding between the existing PCB board and the shielding cover, low welding efficiency and inaccurate welding. The present invention provides a PCB board shielding cover welding process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0015] A PCB shielding cover welding process, comprising the following steps:

[0016] Include the following steps:

[0017] S1: Place the PCB board in the custom-made tray fixture, and operate the scraper to print the solder paste on the PCB board;

[0018] The solder paste printing of the PCB board is carried out by the scraper, the printing is uniform, the printing is accurate, the printing effect of the solder paste is good, and the bonding of the PCB board shielding cover is guaranteed.

[0019] S2: The PCB board shielding cover is loaded through the SMT high-speed machine, and the material is loaded to the designated position of the PCB board, and the solder paste is sandwiched between the PCB board shielding cover and the PCB board;

[0020] The PCB board feeding efficiency is high, and the material is accurately loaded onto the solder paste on the PCB board.

[0021] S3: Cover the corresponding cover plate on the shielding cover of the PCB board, and the cover plate ...

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PUM

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Abstract

The invention discloses a PCB shielding case welding process, which comprises the following steps of: S1, placing a PCB in a customized tray jig, and operating a scraper to carry out solder paste printing on the PCB; S2, enabling the PCB shielding case to be fed through an SMT high-speed machine, and feeding the PCB shielding case to the designated position of the PCB, wherein solder paste is clamped between the PCB shielding case and the PCB; S3, covering the PCB shielding case with a corresponding cover plate, wherein the cover plate compacts the whole shielding case; and S4, feeding the tray jig to a reflow soldering furnace, and completing welding of the PCB, the solder paste and the PCB shielding cover. According to the PCB shielding case welding process, solder paste printing is conducted on the PCB through the scraper, printing is uniform and accurate, the solder paste printing effect is good, attachment of the PCB shielding case is guaranteed, the PCB feeding efficiency is high, PCB welding and sealing are tight, pressing is stable, the positioning effect is good, the reflow soldering furnace welding efficiency is high, welding is accurate, external pollution is avoided during welding, and product welding quality is good.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing, in particular to a PCB board shielding cover welding process and a preparation method thereof. Background technique [0002] At present, electronic products are becoming more and more miniaturized and thinner, which requires that the shielding cover and the PCB board should be closely bonded, and at the same time, there will be no short circuit. In the prior art, an insulating layer is manually attached to the area corresponding to the electronic circuit on the shielding cover on the PCB, so as to achieve the effect of insulation without short circuit, but this process is time-consuming and laborious, and the production efficiency is not high. , the manual paste is not accurate, the paste is not stable, and the insulation layer and the shield itself are polluted due to human factors, which will reduce the quality of the product. Therefore, in view of the above problems, a PCB boa...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 汪爱民
Owner 汪爱民