Parts, plasma device, method for forming corrosion-resistant coating and device therefor

Abstract

The invention discloses a component, a plasma device, a method for forming a corrosion-resistant coating and a device thereof. The corrosion-resistant coating includes: a component body, which includes a surface to be coated, and the surface to be coated is at any level The local height deviation within the range of 100 microns is less than or equal to 20 microns or the average roughness is less than 1 micron; the corrosion-resistant coating is located on the surface to be coated, and the surface of the corrosion-resistant coating is within the range of 50 microns at any horizontal distance The height deviation of the inner local area is less than or equal to 10 microns, and the surface of the corrosion-resistant coating is compact without growth boundaries. The corrosion-resistant coating of the invention has strong plasma corrosion resistance, is not easy to crack, and is not easy to form particle pollution.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a component, a plasma device, a method for forming a corrosion-resistant coating and a device thereof. Background technique [0002] Plasma etching processes play a key role in the field of integrated circuits. The proportion of plasma etching process steps in the latest 5nm semiconductor manufacturing process has increased to more than 17%. The substantial increase in the power and steps of the advanced etching process requires less particle pollution in the plasma etching chamber to further ensure the yield of the etching equipment process. At present, in the most advanced manufacturing process, the requirements for particle pollution have been strict. During the life cycle of the entire component, the particle pollution below 45nm produced is less than 10, and the ground contact rate (zero rate, that is, 45nm particles The probability of 0) is greater than 70%. [0003] At pre...

AI Technical Summary

Problems solved by technology

In the application of the latest advanced manufacturing process, it is found that the roughness of the workpiece surface will cause plasma to form a large number of growth units on the coating surface, each growth unit includes multiple crystal structures, and the junction of each growth unit and adjacent growth units Downward depression, at the junction of adjacent growth units on the coating surface, the plasma concentration is greater than other areas, so preferential corrosion will occur, and further, infiltration along the growth unit boundary may rapidly corrode the material at the growth unit boundary However, it is detached from the surrounding growth units and falls to form large particle pollutants, causing pollution, which further makes the service life of the workpiece coated with yttrium-containing coating much shorter than expected and has to be replaced or refurbished, which greatly increases the operating cost

[0004] However, due to the huge difference in the thermal expansion coefficient of the coating and the substrate body, when a dense coating is formed on a smooth substrate surface, the coating is prone to cracking and even peeling off.

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