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A semiconductor transmission system and transmission method thereof

A transmission system and semiconductor technology, applied in the field of semiconductor processing and production, can solve the problems of high reliability risk, high manipulator cost, large heating time, etc., so as to improve the lofting and sampling speed, realize automatic tray change, and reduce the preheating time. Effect

Active Publication Date: 2022-04-01
芯三代半导体科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art, there are still the following problems: first, in the prior art, the substrate needs to be heated from room temperature to a higher growth temperature during heating, which takes a lot of heating time and higher heating power, which affects the production capacity
Second, the transmission of semiconductor devices in different processes cannot guarantee the stability of the transmission environment, and there is the problem of inconvenient sampling at high temperatures; Realize the structure and function of detecting and changing disks during recycling; fourth, lack of rotation position calibration after substrate transfer; fifth, lack of automatic rotation and alignment of tray and substrate, and then substrate is embedded on tray substrate Slot position
At the same time, in the prior art, most of the operations of picking up discs and taking sheets are performed by manipulators. The combined mode of vacuum manipulators and atmospheric manipulators is adopted, but the vacuum adsorption type vacuum manipulators are required to be double-layered in order to be loaded at a normal and smooth speed. Otherwise, the loading and unloading speed is very slow, the cost of the manipulator is relatively high, and the reliability risk is large

Method used

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  • A semiconductor transmission system and transmission method thereof
  • A semiconductor transmission system and transmission method thereof
  • A semiconductor transmission system and transmission method thereof

Examples

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Effect test

Embodiment 1

[0049] Such as Figure 1~Figure 9 As shown, a semiconductor transmission system includes a transmission chamber 1 and several processing chambers connected to the transmission chamber 1; several processing chambers are respectively arranged on the periphery of the transmission chamber 1, and several processing chambers pass through the vacuum valve The gate is connected with the transmission chamber 1; the vacuum valve gate is the transmission vacuum valve gate 36. Several processing chambers include a film taking chamber 3 connected to the transmission chamber 1, a film loading chamber 2, several reaction chambers, and a buffer chamber 6; the transmission chamber 1 is provided with an internal transfer mechanism 7, and the internal transfer mechanism 7 includes The vacuum manipulator 71; the transfer chamber 1 is provided with an external transfer mechanism 8 and a tray box 91 and an upper material box 93 and a lower material box 92; Realize loading or blanking between 93 an...

Embodiment 2

[0056] Such as Figure 1~Figure 6 As shown, a transport loading method of a semiconductor transport system comprises the following steps,

[0057] Step 1, obtaining the substrate 34;

[0058] Step 2, put the substrate 34 into the film loading chamber 2; adjust the air pressure in the film loading chamber 2 to atmospheric pressure, and put the substrate 34 on the second supporting table 235 of the film loading chamber 2;

[0059] Step 3, lifting the substrate 34 into the air, opening the support finger 2 236, lifting the support platform 235 through the lift cylinder 2 23, so that the substrate 34 rises to the top of the film loading chamber 2, and driving the support finger 2 236 to clamp Hold and close, support the substrate 34, the support table 2 235 resets, and the loading and unloading manipulator 81 resets;

[0060] Step 4, put the tray 5 into the film loading chamber 2, and the tray 5 is located under the raised substrate 34; put the tray 5 on the rotating platform 25...

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Abstract

The invention provides a semiconductor transmission system and a transmission method thereof. The semiconductor transmission system includes a transmission cavity, and several process processing cavities connected to the transmission cavity; several process processing cavities are respectively arranged on the periphery of the transmission cavity, and several process The processing chamber is connected to the transmission chamber through a vacuum gate valve; several process processing chambers include a film taking chamber, a film loading chamber, several reaction chambers, and a buffer chamber connected to the transmission chamber; an internal transfer mechanism is set in the transmission chamber, and the internal transfer mechanism includes Vacuum manipulator for transmission; external transfer mechanism and tray box, upper material box and lower material box are arranged outside the transmission chamber; the external transfer mechanism can Time to realize loading or unloading. The invention provides a stable, convenient and highly reliable semiconductor transmission system and a transmission method thereof.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing and production, in particular to a semiconductor transmission system and a transmission method thereof. Background technique [0002] The CVD equipment in the prior art is a kind of equipment for preparing gallium nitride, silicon carbide or other single crystal thin film materials by chemical vapor deposition. During the reaction process, the substrate is placed on a graphite tray, the temperature is rapidly raised and lowered, and the reaction gas is introduced under appropriate temperature, pressure, rotation speed, flow and other conditions to grow epitaxial materials on the substrate. The epitaxial growth time of a part of the material process is relatively short, accounting for only 1 / 3 or even less of the entire operation process, and the time for heating and cooling, loading, and taking slices accounts for the majority. Therefore, it is necessary to increase the speed of s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67706H01L21/6773H01L21/67736H01L21/67742H01L21/67766H01L21/67778H01L21/67167H01L21/67196
Inventor 蒲勇赵鹏卢勇施建新闫鸿磊
Owner 芯三代半导体科技(苏州)有限公司